Valuation: Kinsus Interconnect Technology Corp.

Market Cap 436B 13.72B 11.97B 11.27B 10.26B 19.24B 1,315B 19.27B 135B 52.02B 670B 51.55B 50.41B 2,161B P/E 2026 *
78.1x
P/E 2027 * 33.5x
Enterprise Value 440B 13.85B 12.07B 11.37B 10.36B 19.42B 1,327B 19.44B 136B 52.49B 676B 52.02B 50.87B 2,181B EV / Sales 2026 *
8.34x
EV / Sales 2027 * 5.64x
Free-Float
60.38%
Yield 2026 *
0.57%
Yield 2027 * 1.38%
1 day-0.60%
1 week+0.61%
Current month+0.98%
1 month-2.82%
3 months+14.23%
6 months+117.63%
Current year+420.13%
1 week 785
Extreme 785
878
1 month 766
Extreme 766
960
Current year 151.5
Extreme 151.5
960
1 year 105
Extreme 105
960
3 years 60.8
Extreme 60.8
960
5 years 60.8
Extreme 60.8
960
10 years 30.3
Extreme 30.3
960
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 30/04/2022
Director of Finance/CFO - 31/07/2000
Director TitleAgeSince
Director/Board Member 65 31/08/2000
Chairman - 10/09/2000
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
-0.60%+0.61%+655.25%+648.42% 13.67B
+6.37%+9.27%+247.92%+560.08% 231B
+0.69%+3.88%-5.95%+244.18% 96.3B
+0.10%-8.76%+279.46%+1,104.18% 54.77B
-0.58%+0.31%+149.07%+1,024.03% 53.35B
+3.98%+4.40%+547.62%+455.86% 50.56B
+2.74%-0.42%+101.98%+682.10% 39.08B
+2.02%-1.75%+66.01%+533.80% 35.46B
+1.65%+15.34% - - 33.12B
+9.23%+8.30%-22.02%+1,095.18% 32.36B
Average +2.56%+5.99%+224.37%+705.31% 63.94B
Weighted average by Cap. +3.50%+7.60%+201.47%+628.07%

Financials

2026 *2027 *
Net sales 52.75B 1.66B 1.45B 1.36B 1.24B 2.33B 159B 2.33B 16.34B 6.3B 81.07B 6.24B 6.1B 262B 78.56B 2.47B 2.16B 2.03B 1.85B 3.47B 237B 3.47B 24.33B 9.38B 121B 9.29B 9.09B 390B
Net income 5.4B 170M 148M 140M 127M 238M 16.28B 239M 1.67B 644M 8.29B 638M 624M 26.76B 12.92B 407M 355M 334M 304M 570M 38.97B 571M 4B 1.54B 19.85B 1.53B 1.49B 64.05B
Net Debt 3.98B 125M 109M 103M 93.71M 176M 12B 176M 1.23B 475M 6.12B 471M 460M 19.73B 7.33B 231M 201M 190M 173M 324M 22.12B 324M 2.27B 875M 11.27B 867M 848M 36.37B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
20/09/26 NT$827.00 -0.60% 23,271,137
18/09/26 NT$832.00 +3.35% 16,702,063
17/09/26 NT$805.00 -1.83% 15,614,754
16/09/26 NT$820.00 +3.14% 10,957,053
15/09/26 NT$795.00 -0.38% 7,509,520
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
827.00TWD
Average target price
952.77TWD
Spread / Average Target
+15.21%

Quarterly revenue - Rate of surprise

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