Valuation: Kinsus Interconnect Technology Corp.

Market Cap 358B 11.08B 9.71B 8.97B 8.25B 15.57B 1,068B 15.82B 107B 42.06B 523B 41.59B 40.68B 1,800B P/E 2026 *
66x
P/E 2027 * 30.6x
Enterprise Value 357B 11.05B 9.69B 8.95B 8.23B 15.54B 1,066B 15.79B 107B 41.97B 521B 41.5B 40.59B 1,796B EV / Sales 2026 *
6.66x
EV / Sales 2027 * 4.57x
Free-Float
60.37%
Yield 2026 *
0.66%
Yield 2027 * 1.54%
1 day-2.02%
1 week-14.59%
Current month-23.79%
1 month-6.22%
3 months+73.44%
6 months+221.04%
Current year+327.04%
1 week 653
Extreme 653
859
1 month 653
Extreme 653
939
Current year 151.5
Extreme 151.5
939
1 year 99.9
Extreme 99.9
939
3 years 60.8
Extreme 60.8
939
5 years 60.8
Extreme 60.8
939
10 years 30.3
Extreme 30.3
939
Manager TitleAgeSince
Chief Executive Officer - -
Director of Finance/CFO - 31/07/2000
Chief Operating Officer - -
Director TitleAgeSince
Chairman 65 31/08/2000
Chairman - 10/09/2000
Director/Board Member - 31/08/2003
Change 5-day change 1-year change 3-year change Capi.($)
-2.02%-14.59%+572.28%+498.24% 11.27B
-0.89%-14.90%+136.88%+379.89% 166B
+3.03%-12.43%+48.09%+259.91% 104B
-10.00%-10.14%+301.64%+822.58% 65.06B
-2.22%-17.00%+328.78%+1,282.08% 49.7B
+5.26%-9.72% - - 46.04B
-5.54%-14.29%+463.91%+269.46% 40.19B
-10.00%-11.14%+120.77%+371.01% 36.28B
-7.20%-17.61%+38.28%+736.23% 34.1B
-2.89%-23.86%+146.47%+429.07% 33.56B
Average -3.25%-15.69%+239.68%+560.94% 58.67B
Weighted average by Cap. -2.22%-13.96%+183.87%+512.10%

Financials

2026 *2027 *
Net sales 53.62B 1.66B 1.45B 1.34B 1.24B 2.33B 160B 2.37B 16.08B 6.3B 78.32B 6.23B 6.1B 270B 77.09B 2.39B 2.09B 1.93B 1.78B 3.36B 230B 3.41B 23.12B 9.06B 113B 8.96B 8.77B 388B
Net income 5.21B 161M 141M 131M 120M 227M 15.57B 231M 1.56B 613M 7.62B 606M 593M 26.24B 10.62B 329M 288M 266M 245M 462M 31.71B 470M 3.19B 1.25B 15.51B 1.23B 1.21B 53.45B
Net Debt -772M -23.91M -20.96M -19.37M -17.82M -33.62M -2.31B -34.16M -232M -90.81M -1.13B -89.79M -87.84M -3.89B -5.43B -168M -147M -136M -125M -236M -16.22B -240M -1.63B -639M -7.93B -631M -618M -27.34B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
19/07/26 NT$679.00 -2.02% 23,700,020
17/07/26 NT$693.00 -10.00% 3,693,770
16/07/26 NT$770.00 -8.88% 2,674,083
15/07/26 NT$845.00 +4.97% 4,103,308
14/07/26 NT$805.00 -1.71% 3,717,468
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
12
Last Close Price
679.00TWD
Average target price
868.00TWD
Spread / Average Target
+27.84%

Quarterly revenue - Rate of surprise

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