UNION SEMICONDUCTOR (HEFEI) CO., LTD. Union Semiconductor (Hefei) Co., Ltd. Share Price
Equities
688403
CNE100005PP0
Semiconductor Equipment & Testing
|
End-of-day quote
Other stock markets
|
5-day change | 1st Jan Change | ||
| 8.07 CNY | +1.64% |
|
-3.93% | -23.51% |
| Sales 2022 | 940M 130M 10.23B | Sales 2023 | 1.24B 171M 13.48B | Capitalization | 8.81B 1.22B 95.91B |
|---|---|---|---|---|---|
| Net income 2022 | 177M 24.48M 1.93B | Net income 2023 | 196M 27.11M 2.13B | EV / Sales 2022 | 8.42 x |
| Net cash position 2022 | 848M 117M 9.23B | Net Debt 2023 | 48.44M 6.7M 528M | EV / Sales 2023 | 7.15 x |
| P/E ratio 2022 |
43.7
x | P/E ratio 2023 |
45.9
x | Employees | 1,439 |
| Yield 2022 * |
-
| Yield 2023 |
0.95% | Free-Float | 46.01% |
More Fundamentals
* Assessed data
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| 1 day | +1.64% | ||
| 1 week | -3.93% | ||
| Current month | -2.18% | ||
| 1 month | +6.75% | ||
| 3 months | -8.92% | ||
| 6 months | -28.07% | ||
| Current year | -23.51% |
1 week
7.82
8.32
1 month
7.368.92
Current year
6.8410.58
1 year
6.8414.54
3 years
6.8419.18
5 years
6.8419.18
10 years
6.8419.18
| Managers | Title | Age | Since |
|---|---|---|---|
Rui Jun Zheng
CEO | Chief Executive Officer | 61 | 31/05/16 |
Zhou Feng Shi
DFI | Director of Finance/CFO | 42 | 31/10/19 |
Wen Hao Lin
CTO | Chief Tech/Sci/R&D Officer | 54 | 25/03/21 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Hui Yang
BRD | Director/Board Member | 60 | 25/03/21 |
Ya Bin Zhao
BRD | Director/Board Member | 57 | 25/03/21 |
Min Cheng
BRD | Director/Board Member | 58 | 25/03/21 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 17/05/24 | 8.07 | +1.64% | 6,357,446 |
| 16/05/24 | 7.94 | +0.38% | 7,609,858 |
| 15/05/24 | 7.91 | -3.42% | 7,480,295 |
| 14/05/24 | 8.19 | +0.37% | 6,738,268 |
| 13/05/24 | 8.16 | -2.86% | 7,620,317 |
End-of-day quote Shanghai S.E., May 16, 2024
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Union Semiconductor Hefei Co Ltd is a China-based company that mainly provides comprehensive services for full-process packaging and testing of display driver chips. The Company's main businesses include front-end gold bumping, wafer testing (CP) and back-end chip-on-glass (COG) and chip-on-film (COF). Its packaging and testing services are mainly used in display driver chips for various mainstream panels. The Company mainly distributes its products in domestic market, including Hong Kong and Taiwan.
Calendar
11/08/2024
- Q2 2024 Earnings Release (Projected)
| 1st Jan change | Capi. | |
|---|---|---|
| -23.51% | 921M | |
| +16.45% | 119B | |
| +44.17% | 107B | |
| +12.22% | 20.32B | |
| +8.08% | 19.53B | |
| +46.17% | 11.01B | |
| +32.40% | 9.77B | |
| -1.77% | 8.04B | |
| -24.81% | 6B | |
| +26.17% | 5.02B |
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