Union Semiconductor (Hefei) Co., Ltd.

688403

CNE100005PP0

Semiconductor Equipment & Testing

End-of-day quote Shanghai S.E. Other stock markets 23:00:00 30/05/2024 BST			5-day change	1st Jan Change
8.77 ^CNY	+1.98%		+3.79%	-16.87%

04-22	Union Semiconductor Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	CI
04-02	Tranche Update on Union Semiconductor Co., Ltd.'s Equity Buyback Plan announced on December 23, 2023.	CI

Union Semiconductor Co., Ltd. authorizes a Buyback Plan.

December 20, 2023

The Board of Directors of Union Semiconductor (Hefei) Co., Ltd. has authorized a buyback plan on December 21, 2023.

Latest news about Union Semiconductor (Hefei) Co., Ltd.

Union Semiconductor Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	04-22	CI
Tranche Update on Union Semiconductor Co., Ltd.'s Equity Buyback Plan announced on December 23, 2023.	04-01	CI
Union Semiconductor Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	02-23	CI
Tranche Update on Union Semiconductor Co., Ltd.'s Equity Buyback Plan announced on December 23, 2023.	01-03	CI
Union Semiconductor Co., Ltd. announces an Equity Buyback for CNY 100 million worth of its shares.	12-22	CI
Union Semiconductor Co., Ltd. authorizes a Buyback Plan.	12-20	CI
Union Semiconductor to Issue 1.15 billion Yuan Convertible Bonds	11-03	MT
Union Semiconductor Co., Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2023	27/10/23	CI
Union Semiconductor Co., Ltd.(SHSE:688403) added to Shanghai Stock Exchange Composite Index	22/08/23	CI
Union Semiconductor Co., Ltd.(SHSE:688403) added to Shanghai Stock Exchange A Share Index	22/08/23	CI
Union Semiconductor Co., Ltd. Reports Earnings Results for the Half Year Ended June 30, 2023	11/08/23	CI
Certain A Shares of Union Semiconductor Co., Ltd. are subject to a Lock-Up Agreement Ending on 10-AUG-2023.	09/08/23	CI
Union Semiconductor Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	26/04/23	CI
Union Semiconductor Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	27/02/23	CI
Union SemiConductor Co., Ltd. announced that it expects to receive CNY 300 million in funding from Union Semiconductor Co., Ltd.	19/12/22	CI
Union Semiconductor Co., Ltd. has completed an IPO in the amount of CNY 1.482699 billion.	10/08/22	CI

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Union Semiconductor Hefei Co Ltd is a China-based company that mainly provides comprehensive services for full-process packaging and testing of display driver chips. The Company's main businesses include front-end gold bumping, wafer testing (CP) and back-end chip-on-glass (COG) and chip-on-film (COF). Its packaging and testing services are mainly used in display driver chips for various mainstream panels. The Company mainly distributes its products in domestic market, including Hong Kong and Taiwan.

Sector

Semiconductor Equipment & Testing

Calendar

11/08/2024 - Q2 2024 Earnings Release (Projected)

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