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Valuation: Amkor Technology, Inc.

Capitalization 16.93B 0 0 0 0 0 0 0 0 0 0 0 0 P/E ratio 2026 *
32.7x
P/E ratio 2027 * 30.3x
Enterprise value 18.18B 0 0 0 0 0 0 0 0 0 0 0 0 EV / Sales 2026 *
2.39x
EV / Sales 2027 * 2.16x
Free-Float
42.26%
Yield 2026 *
0.49%
Yield 2027 * 0.53%

Last Transcript: Amkor Technology, Inc.

1 day+5.14%
1 week-6.13%
Current month-1.83%
1 month-10.86%
3 months+64.12%
6 months+52.74%
Current year+72.97%
1 week 64.32
Extreme 64.32
79.5
1 month 62.45
Extreme 62.45
79.5
Current year 40.22
Extreme 40.22
79.5
1 year 19.79
Extreme 19.7902
79.5
3 years 14.03
Extreme 14.03
79.5
5 years 14.03
Extreme 14.03
79.5
10 years 5.33
Extreme 5.33
79.5
Manager TitleAgeSince
Chief Executive Officer 54 31/12/2025
Director of Finance/CFO 52 11/09/2016
Chief Operating Officer - 31/07/1990
Director TitleAgeSince
Director/Board Member 70 31/01/2006
Director/Board Member 72 14/05/2019
Director/Board Member 70 31/01/2013
Date Insider Type Main position Quantity % Market Cap.
05-18Sell

Chief Financial Officer

-1,000 0.0004%
05-17Fiscal year

General Counsel

15,000 0.0061%
05-12Fiscal year

Director

22,399 0.0090%
Change 5d. change 1-year change 3-years change Capi.($)
+5.14%-6.13%+254.57%+157.60% 16.93B
+3.58%+8.65%+126.87%+128.55% 673B
+6.98%+2.31%+275.74%+427.96% 406B
+10.45%+13.07%+154.58%+221.15% 155B
-6.41%-10.15%+288.49%+340.82% 75.06B
+7.25%+25.49%+1,365.76%+1,865.88% 25.7B
+5.22%+4.84%+176.36%+95.72% 21.87B
+5.82%-2.23%+81.99%+21.37% 20.24B
+6.63%+11.00%+136.65%+224.55% 13.88B
+6.22%+5.19%+179.91%+139.70% 13.38B
Average +5.10%+2.92%+304.09%+362.33% 142.07B
Weighted average by Cap. +4.96%+5.12%+205.60%+266.15%

Financials

2026 *2027 *
Net sales 7.62B 0 0 0 0 0 0 0 0 0 0 0 0 8.45B 0 0 0 0 0 0 0 0 0 0 0 0
Net income 522M 0 0 0 0 0 0 0 0 0 0 0 0 625M 0 0 0 0 0 0 0 0 0 0 0 0
Net Debt 1.26B 0 0 0 0 0 0 0 0 0 0 0 0 1.33B 0 0 0 0 0 0 0 0 0 0 0 0
Logo Amkor Technology, Inc.
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Employees
30,800
Date Price Change Volume
08/06/26 68.29 $ +5.14% 4,401,145
05/06/26 64.95 $ -12.02% 5,688,694
04/06/26 73.82 $ -1.84% 6,486,690
03/06/26 75.20 $ +0.62% 4,991,476
02/06/26 74.74 $ +2.74% 6,364,151
Trader
Investor
Global
Quality
ESG MSCI
BBB
Sell
Consensus
Buy
Mean consensus
OUTPERFORM
Number of Analysts
10
Last Close Price
68.29USD
Average target price
75.50USD
Spread / Average Target
+10.56%

Quarterly revenue - Rate of surprise

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