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Valuation: Shenzhen Fastprint Circuit Tech Co.,Ltd.

Market Cap 90.46B 13.36B 11.67B 10.79B 10.08B 18.91B 1,262B 19.05B 128B 49.91B 621B 50.14B 49.06B 2,156B P/E 2026 *
119x
P/E 2027 * 94.4x
Enterprise Value 95.18B 14.05B 12.28B 11.36B 10.6B 19.9B 1,328B 20.05B 135B 52.51B 653B 52.76B 51.62B 2,268B EV / Sales 2026 *
8.26x
EV / Sales 2027 * 6.61x
Free-Float
74.03%
Yield 2026 *
0.25%
Yield 2027 * 0.32%
04-26 Shenzhen Fastprint Circuit Tech Co.,Ltd. announces Annual dividend, payable on May 28, 2026 CI
04-24 Shenzhen Fastprint Circuit Tech Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2026 CI
04-24 Shenzhen Fastprint Circuit Tech Co.,Ltd. Reports Earnings Results for the Full Year Ended December 31, 2025 CI
04-24 Shenzhen Fastprint Circuit Tech Co.,Ltd. announces an Equity Buyback for CNY 100 million worth of its shares. CI
04-22 Shenzhen Fastprint Circuit Tech Co.,Ltd. authorizes a Buyback Plan. CI
03-16 Fastprint Circuit Tech to Buy Wealth Management Products for 550 Million Yuan; Shares Down 4% MT
30/10/25 Shenzhen Fastprint Circuit Tech Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2025 CI
27/08/25 Fastprint Circuit Tech H1 Profit up 49%, Revenue Climbs 19% MT
26/08/25 Shenzhen Fastprint Circuit Tech Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2025 CI
03/08/25 Connexion Technologies Limited acquired eXception PCB Solutions Limited. CI
29/07/25 Shenzhen Fastprint Circuit Tech Finalizes 24% Stake Acquisition in Guangzhou Xinke Semiconductor MT
27/07/25 Shenzhen Fastprint Circuit Tech Co.,Ltd. acquired an additional 24% stake in Guangzhou Xingke Semiconductor Co., Ltd. from China Integrated Circuit Industry Investment Fund Co., Ltd. managed by Huaxin Investment Management Co., Ltd. for approximately CNY 320 million. CI
12/06/25 Fastprint Circuit Tech Bids for 24% Stake in Semiconductor Subsidiary MT
1 day+2.38%
1 week+41.01%
Current month+37.80%
1 month+60.11%
3 months+145.96%
6 months+177.60%
Current year+151.77%
1 week 39.68
Extreme 39.68
55
1 month 35.01
Extreme 35.01
55
Current year 19.51
Extreme 19.51
55
1 year 11.78
Extreme 11.78
55
3 years 8.05
Extreme 8.05
55
5 years 7.24
Extreme 7.24
55
10 years 3.02
Extreme 3.02
55
Manager TitleAgeSince
Chief Executive Officer 58 28/02/1999
Director of Finance/CFO 41 28/10/2025
Chief Tech/Sci/R&D Officer 53 06/05/2021
Director TitleAgeSince
Director/Board Member 57 20/04/2017
Chairman 58 28/02/1999
Director/Board Member 60 20/04/2017
Date Insider Type Main position Quantity % Market Cap.
23/09/25Buy

Chief Executive Officer

50,000 0.0033%
22/09/25Sell

Chief Executive Officer

1,322,900 0.0882%
14/09/25Sell

Chief Executive Officer

2,420,000 0.1613%
Change 5-day change 1-year change 3-year change Capi.($)
+2.38%+41.01%+346.40%+261.85% 13.05B
+1.71%+6.82%+257.20%+544.30% 221B
+3.14%+10.12%+99.75%+285.82% 100B
-0.90%+24.36%+645.32%+917.87% 73.52B
+4.02%+20.60%+595.11%+2,322.04% 63.4B
-0.98%+11.67%+221.54%+1,405.56% 53.35B
+3.82%+11.42%+905.00%+437.43% 48.58B
+0.78%+20.51%+360.89%+666.85% 45.67B
-1.54%+9.08% - - 45.51B
-1.78%+16.02%+236.17%+572.81% 42.05B
Average +1.06%+10.50%+407.49%+823.84% 70.68B
Weighted average by Cap. +1.33%+6.52%+361.17%+783.41%

Financials

2026 *2027 *
Net sales 11.53B 1.7B 1.49B 1.38B 1.28B 2.41B 161B 2.43B 16.35B 6.36B 79.07B 6.39B 6.25B 275B 14.4B 2.13B 1.86B 1.72B 1.6B 3.01B 201B 3.03B 20.41B 7.94B 98.75B 7.98B 7.81B 343B
Net income - -
Net Debt 4.72B 697M 609M 563M 526M 987M 65.83B 994M 6.69B 2.6B 32.37B 2.62B 2.56B 112B 4.64B 685M 599M 554M 517M 970M 64.75B 978M 6.58B 2.56B 31.84B 2.57B 2.52B 111B
Logo Shenzhen Fastprint Circuit Tech Co.,Ltd.
Shenzhen Fastprint Circuit Tech Co Ltd is a China-based company principally engaged in printed circuit board (PCB) business and semiconductor business. The printed circuit board business is mainly engaged in research and development, design, production and sales of printed circuit boards. The semiconductor business includes integrated circuit (IC) packaging substrates and semiconductor test board businesses. Integrated circuit packaging substrate products include chip-scale packaging (CSP) substrates and flip chip ball grid array (FCBGA) packaging substrates, and the application areas include memory chips, radio frequency chips, application processor chips and others. Semiconductor test board product types include probe cards, test load boards, aging boards, and adapter boards, which are used in various processes from wafer testing to post-packaging testing. The Company mainly conducts its businesses in the domestic and overseas markets.
Employees
7,761
Date Price Change Volume
21/06/26 53.30 ¥ +2.38% 213,598,900
18/06/26 52.06 ¥ +8.91% 239,802,600
17/06/26 47.80 ¥ +8.39% 258,119,600
16/06/26 44.10 ¥ +10.00% 201,324,300
15/06/26 40.09 ¥ +6.06% 161,510,100
Trader
Investor
Global
Quality
-
ESG MSCI
-
Sell
Consensus
Buy
Mean consensus
OUTPERFORM
Number of Analysts
2
Last Close Price
53.30CNY
Average target price
19.40CNY
Spread / Average Target
-63.60%

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