Now in its 11th year, this prestigious program enlists experienced optical communications industry experts to evaluate new products for their innovative contributions to fiberoptics and optoelectronics applications.
A silicone-free phase change TIM, Bergquist Hi Flow THF 5000UT delivers thin bond line capability with low pressure and low thermal impedance to dissipate heat from large die processors and power applications often used in data center systems. Tested and validated for a wide power range of up to 800 W, the material helps protect high-value devices from damaging heat and pressure and contributes to overall operating expense reduction.
'The function-limiting effects of heat in the data center is one of today's most challenging industry issues,' explains
Most TIMs require mechanical pressure using screws or clips to achieve ultra-thin bond lines and thorough wet out. But thin, delicate multi-die ICs can be damaged if the pressure is too high. Bergquist Hi Flow THF 5000UT delivers exceptionally low thermal resistance at market-leading low mechanical pressure, which is essential for multi-chip devices used in high-performance compute applications.
Lightwave Editor-in-Chief
The Lightwave Innovation Review recognition is the second recent industry honor for
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