Valuation: Epoxy Base Electronic Material Corporation Limited

Capitalization 8.38B 1.2B 1.03B 955M 896M 1.66B 110B 1.78B 10.96B 4.34B 52.1B 4.51B 4.42B 190B P/E ratio 2023
69.8x
P/E ratio 2024 134x
Enterprise value 7.05B 1.01B 866M 804M 754M 1.4B 92.75B 1.5B 9.22B 3.65B 43.84B 3.8B 3.72B 160B EV / Sales 2023
2.28x
EV / Sales 2024 2.22x
Free-Float
39.03%
Yield 2023
0.8%
Yield 2024 0.37%
More valuation ratios * Estimated data
Dynamic Chart
29/10/25 Epoxy Base Electronic Material Corporation Limited Reports Earnings Results for the Nine Months Ended September 30, 2025 CI
26/08/25 Epoxy Base Electronic Material Corporation Limited Reports Earnings Results for the Half Year Ended June 30, 2025 CI
05/06/25 Zhuhai Hongchang Electronic Materials Co., Ltd. announced that it has received CNY 201.7204 million in funding from Epoxy Base Electronic Material Corporation Limited CI
27/05/25 Epoxy Base Electronic Material to Raise Electronic Materials Unit's Capital to $124 Million MT
06/05/25 Zhuhai Hongchang Electronic Materials Co., Ltd. announced that it expects to receive CNY 201.7204 million in funding from Epoxy Base Electronic Material Corporation Limited CI
28/04/25 Epoxy Base Electronic Material Corporation Limited Reports Earnings Results for the First Quarter Ended March 31, 2025 CI
23/04/25 Epoxy Base Electronic Material Corporation Limited announces Annual dividend, payable on June 13, 2025 CI
23/04/25 Epoxy Base Electronic Material Corporation Limited Reports Earnings Results for the Full Year Ended December 31, 2024 CI
21/04/25 Epoxy Base Electronic Material Corporation Limited announced that it expects to receive CNY 300 million in funding CI
29/10/24 Epoxy Base Electronic Material Corporation Limited Reports Earnings Results for the Nine Months Ended September 30, 2024 CI
22/09/24 Epoxy Base Electronic Material Corporation Limited(XSSC:603002) added to S&P Global BMI Index CI
23/08/24 Epoxy Base Electronic Material Corporation Limited Reports Earnings Results for the Half Year Ended June 30, 2024 CI
25/06/24 Epoxy Base Electronic Material's Unit Gets Patent for Diisocyanate Monomer System MT
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1 day+4.66%
1 week+12.81%
Current month+15.56%
1 month+21.48%
3 months+24.13%
6 months+24.67%
Current year+15.56%
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1 week 7.5
Extreme 7.5
8.92
1 month 7.05
Extreme 7.05
8.92
Current year 7.36
Extreme 7.36
8.92
1 year 4.46
Extreme 4.46
9.03
3 years 3.57
Extreme 3.57
9.03
5 years 3.57
Extreme 3.57
10.19
10 years 3.29
Extreme 3.29
10.19
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Manager TitleAgeSince
Chief Executive Officer 59 08/05/2014
Director of Finance/CFO 51 31/07/2004
Corporate Officer/Principal 63 13/04/2015
Director TitleAgeSince
Director/Board Member 63 18/04/2017
Director/Board Member 72 04/05/2016
Chairman 65 30/01/2008
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Change 5d. change 1-year change 3-years change Capi.($)
+4.66%+12.81%+40.92%+61.13% 1.33B
+1.82%-1.41%-14.25%+8.86% 32.31B
+1.79%-9.38%-5.93%-14.43% 3.14B
-2.78%+4.15%+74.44%+2.46% 2.36B
+0.65%+2.19%+56.75%+117.18% 1.92B
+1.11%+0.87% - - 1.97B
+2.49%+24.63%+49.92% - 1.84B
-0.40%+2.83%+54.57%+30.91% 1.28B
-1.08%-0.47%-0.16%+137.55% 1.23B
+0.59%-1.71%+171.34%+216.73% 1.12B
Average +0.87%+1.30%+47.51%+70.05% 4.85B
Weighted average by Cap. +1.35%-0.72%+4.57%+22.47%
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Financials

2023 2024
Net sales 2.24B 322M 275M 255M 239M 444M 29.47B 476M 2.93B 1.16B 13.93B 1.21B 1.18B 50.88B 2.14B 308M 263M 244M 229M 425M 28.21B 455M 2.8B 1.11B 13.33B 1.15B 1.13B 48.69B
Net income 86.63M 12.44M 10.64M 9.87M 9.26M 17.18M 1.14B 18.4M 113M 44.84M 539M 46.65M 45.7M 1.97B 50.61M 7.27M 6.21M 5.77M 5.41M 10.04M 666M 10.75M 66.19M 26.19M 315M 27.25M 26.69M 1.15B
Net Debt -2.01B -289M -247M -229M -215M -399M -26.47B -427M -2.63B -1.04B -12.51B -1.08B -1.06B -45.7B -1.33B -191M -163M -152M -142M -264M -17.49B -282M -1.74B -688M -8.26B -716M -701M -30.19B
More financial data * Estimated data
Logo Epoxy Base Electronic Material Corporation Limited
Epoxy Base Electronic Material Corp Ltd is a China-based company principally engaged in the production and sale of electronic grade epoxy resins and copper clad laminate products. The Company's main products include liquid epoxy resins, flame retardant epoxy resins, solid epoxy resins, solvent epoxy resins, high-frequency and high-speed copper-clad laminates and substrates for high-density interconnection. The Company's products are mainly used in such fields as electrical and electronic, coatings, composite materials, consumer electronics, network communication equipment, smart home electronic equipment and others. The Company distributes its products in domestic market and to overseas markets.
Employees
642
More about the company
Date Price Change Volume
20/01/26 8.540 ¥ +4.66% 97,057,660
20/01/26 8.160 ¥ +1.12% 45,169,790
19/01/26 8.070 ¥ -0.12% 41,019,970
16/01/26 8.080 ¥ -1.34% 85,757,600
15/01/26 8.190 ¥ +8.05% 116,907,400

End-of-day quote Shanghai S.E., January 20, 2026

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