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Valuation: Darbond Technology Co., Ltd

Capitalization 10.37B 1.53B 1.33B 1.22B 1.14B 2.13B 146B 2.17B 14.46B 5.63B 70.55B 5.75B 5.62B 245B P/E ratio 2026 *
73.8x
P/E ratio 2027 * 53.5x
Enterprise value 10.37B 1.53B 1.33B 1.22B 1.14B 2.13B 146B 2.17B 14.46B 5.63B 70.55B 5.75B 5.62B 245B EV / Sales 2026 *
5.34x
EV / Sales 2027 * 4.35x
Free-Float
56.1%
Yield 2026 *
-
Yield 2027 * -
1 day+0.19%
1 week+2.43%
Current month+2.43%
1 month-1.84%
3 months+13.15%
6 months+70.25%
Current year+60.73%
1 week 72.5
Extreme 72.5
79.99
1 month 72.5
Extreme 72.5
96.8
Current year 48.72
Extreme 48.72
96.8
1 year 37.05
Extreme 37.05
96.8
3 years 23.23
Extreme 23.23
96.8
5 years 23.23
Extreme 23.23
96.8
10 years 23.23
Extreme 23.23
96.8
Manager TitleAgeSince
Chief Executive Officer 68 30/04/2010
Director of Finance/CFO 47 10/12/2020
Corporate Officer/Principal - 31/12/2002
Director TitleAgeSince
Director/Board Member 62 30/11/2020
Director/Board Member 60 10/12/2020
Chairman 59 30/09/2016
Date Insider Type Main position Quantity % Market Cap.
08/09/25Buy

Executive/Senior Manager

17,040 0.0211%
18/08/25Sell

Executive/Senior Manager

17,040 0.0211%
18/08/25Sell 12,390 0.0153%
Change 5d. change 1-year change 3-years change Capi.($)
+0.19%+2.43%+100.49%+40.41% 1.61B
-0.58%+1.31%-4.12%-12.38% 30.02B
+0.05%-3.20%+4.76%-10.43% 3.26B
-0.42%+6.42%+126.35%+74.30% 2.97B
-4.67%+1.03%+190.80%+231.68% 2.8B
-3.32%-4.48%+140.69%+160.11% 2.39B
-4.86%-7.28%+93.30%+146.68% 2.35B
-4.23%-11.65% - - 1.5B
+8.11%+23.58%+132.71%+207.26% 1.45B
-2.01%+2.09%+6.39%+103.61% 1.4B
Average -1.20%+0.31%+87.93%+104.58% 4.98B
Weighted average by Cap. -1.00%+0.39%+35.66%+35.28%

Financials

2026 *2027 *
Net sales 1.94B 287M 248M 228M 214M 399M 27.34B 406M 2.71B 1.05B 13.22B 1.08B 1.05B 45.98B 2.39B 352M 305M 280M 263M 490M 33.57B 498M 3.33B 1.29B 16.23B 1.32B 1.29B 56.45B
Net income 142M 20.93M 18.12M 16.63M 15.64M 29.14M 1.99B 29.59M 198M 76.92M 964M 78.58M 76.87M 3.35B 197M 29.08M 25.18M 23.11M 21.74M 40.49M 2.77B 41.13M 275M 107M 1.34B 109M 107M 4.66B
Net Debt - -
Logo Darbond Technology Co., Ltd
Darbond Technology Co Ltd is a China-based company mainly engaged in the research, development and industrialization of electronic packaging materials. The products include integrated circuit packaging materials, smart terminal packaging materials, new energy application materials and equipment application materials. Integrated circuit packaging materials mainly include wafer ultraviolet (UV) films, die-bonding materials and flip-chip materials. Smart terminal packaging materials mainly include electronic packaging materials, electromagnetic interference (EMI) shielding materials and board-level packaging materials. New energy packaging materials mainly include two-component polyurethane structural adhesives, UV insulating coatings, tapes and photovoltaic stacked materials. Equipment application materials mainly include one-component epoxy structural adhesives, thread-locking anaerobic adhesives and water-based two-component epoxy structural adhesives.
Employees
980
Date Price Change Volume
08/06/26 73.78 ¥ -4.86% 5,883,059
05/06/26 77.55 ¥ +0.19% 6,515,924
04/06/26 77.40 ¥ +0.98% 5,829,415
03/06/26 76.65 ¥ +2.36% 6,489,216
02/06/26 74.88 ¥ -0.69% 5,508,189
Trader
-
Investor
Global
-
Quality
ESG MSCI
-
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
77.55CNY
Average target price
57.00CNY
Spread / Average Target
-26.50%

Annual profits - Rate of surprise

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