E&R ENGINEERING CORPORATION is principally engaged in the manufacture and sale of packaging and testing equipment for semiconductors and electronics. The Companyâ€™s products consist of laser markers, plasma cleaning machines, dispensers, molding cutting equipment, embossed carrier tapes, flexible printed circuit (FPC) equipment and related components, as well as automation equipment, among others. The Companyâ€™s products are mainly applied in semiconductor industry. The Company distributes its products within domestic market and to overseas markets.

Employees

Sector

Semiconductor Equipment & Testing

More about the company

Quotes

Date	Price	Change	Volume
03/11/26	NT$150.00	+0.67%	1,500,412
03/11/26	NT$149.00	-8.31%	1,703,045
02/11/26	NT$162.50	-0.61%	945,025
30/10/26	NT$163.50	-6.30%	1,514,119
29/10/26	NT$174.50	-4.12%	819,027

End-of-day quote Taipei Exchange

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Quarterly revenue - Rate of surprise

Rate of surprise - Net sales - Quarterly - E&R Engineering Corporation

Company calendar

End-of-day quote Taipei Exchange 04/11/2026			5-day change	1st Jan Change
150.00 ^TWD	+0.67%		-12.54%	+36.99%

10-06	E&R Engineering Corp. Spotlights High-Precision Cpo and Advanced Packaging Solutions At Semi West 2026	CI
10-05	E&R Engineering to Launch New Malaysia Plant: Expanding Global Packaging Materials Production and Localized Services	CI

Market Cap	16.1B 490M 436M 400M 364M 683M 46.26B 699M 4.78B 1.92B 24.48B 1.84B 1.8B 77.56B	P/E 2024	-170x	P/E 2025	-118x
Enterprise Value	16.38B 498M 444M 407M 370M 695M 47.06B 711M 4.86B 1.95B 24.91B 1.87B 1.83B 78.91B	EV / Sales 2024	5.31x	EV / Sales 2025	6.49x
Free-Float	76.64%	Yield 2024 *	-	Yield 2025	-

10-06	E&R Engineering Corp. Spotlights High-Precision Cpo and Advanced Packaging Solutions At Semi West 2026	CI
10-05	E&R Engineering to Launch New Malaysia Plant: Expanding Global Packaging Materials Production and Localized Services	CI
10-05	E&R Engineering to Open Malaysian Unit	MT
08-26	E&R Engineering Launches New High-Precision Laser Drilling and Advanced Hybrid Plasma Solutions for CPO and Advanced Packaging at SEMICON Taiwan 2026	CI
08-11	E&R Engineering Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2026	CI
05-13	E&R Engineering Corporation Reports Earnings Results for the First Quarter Ended March 31, 2026	CI
04-30	E&R Engineering Showcases Advanced Laser and Plasma Solutions At SEMICON SEA 2026	CI
03-18	E&R Engineering Corp. Opens Portland Office and Expands Dual-U.S. Presence	CI
03-13	E&R Engineering Corporation Reports Earnings Results for the Full Year Ended December 31, 2025	CI
02-10	Capital Securities Downgrades E&R Engineering Corporation to Neutral from Buy, Price Target is NT$98	MT
11-11	E&R Engineering Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2025	CI
25/09/25	E&R Engineering Corp. Strengthens North American Semiconductor Presence with New U.S. Subsidiary	CI
10/08/25	E&R Engineering Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2025	CI

1 day	+0.67%
1 week	-12.54%
Current month	-8.26%
1 month	-29.74%
3 months	-9.64%
6 months	-22.48%
Current year	+36.99%

E&R Engineering Corporation Share Price

Stocks

8027

TW0008027004

Semiconductor Equipment & Testing

Valuation: E&R Engineering Corporation

Chart: E&R Engineering Corporation

Latest news: E&R Engineering Corporation

Analysts' recommendations: E&R Engineering Corporation

Quotes and Performance

Price Extremes

Managers and Directors: E&R Engineering Corporation

Semiconductor Machinery Manufacturing

Financials

Company Profile

Quotes

Quarterly revenue - Rate of surprise

1 week	140	183.5
1 month	140	218
Current year	85.8	297
1 year	83.2	297
3 years	54.8	297
5 years	41.85	297
10 years	12.99	297

Manager	Title	Age	Since
Kun Shan Chen CEO	Chief Executive Officer	-	17/06/2026
Kuang Ming Chang CEO	Chief Executive Officer	-	-
Chiang Ting Huang CIO	Chief Investment Officer	-	17/06/2026

Director	Title	Age	Since
Ming Ching Wang CHM	Chairman	-	23/10/1994
Kuang Ming Chang BRD	Director/Board Member	-	31/07/1998
Kun Shan Chen BRD	Director/Board Member	-	20/06/2023

Add to a list 0 selected To use this feature you must be a member Log in Sign up	Change	5-day change	1-year change	3-year change	Capi.($)
E&R ENGINEERING CORPORATION	+0.67%	-12.54%	+61.81%	+131.84%	487M
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APPLIED MATERIALS, INC.	-4.37%	-12.09%	+58.88%	+160.56%	303B
LAM RESEARCH CORPORATION	-4.59%	-13.19%	+41.44%	+244.78%	288B
KLA CORPORATION	-4.91%	-5.95%	+25.11%	+199.32%	204B
ADVANTEST CORPORATION	-3.35%	+2.10%	+49.43%	+775.41%	163B
TOKYO ELECTRON LIMITED	-3.42%	+2.91%	+41.35%	+129.42%	143B
ASE TECHNOLOGY HOLDING CO., LTD.	+1.79%	-3.69%	+154.88%	+433.62%	82.55B
NAURA TECHNOLOGY GROUP CO., LTD.	+10.00%	+9.62%	+33.54%	+181.25%	53.09B
TERADYNE, INC.	-7.73%	-20.31%	+42.12%	+184.93%	42.05B
Average	-1.87%	-1.72%	+55.29%	+256.49%	187.17B
Weighted average by Cap.	-3.32%	-1.20%	+48.90%	+230.42%

	2024	2025
Net sales	1.64B 50.01M 44.57M 40.87M 37.14M 69.82M 4.73B 71.42M 488M 196M 2.5B 188M 184M 7.92B	1.81B 55.01M 49.02M 44.96M 40.86M 76.81M 5.2B 78.56M 537M 215M 2.75B 206M 202M 8.72B
Net income	-51.12M -1.55M -1.39M -1.27M -1.15M -2.17M -147M -2.22M -15.18M -6.09M -77.75M -5.83M -5.71M -246M	-97.8M -2.97M -2.65M -2.43M -2.21M -4.15M -281M -4.25M -29.04M -11.64M -149M -11.16M -10.92M -471M
Net Debt	-248M -7.55M -6.73M -6.17M -5.61M -10.55M -714M -10.79M -73.78M -29.58M -378M -28.35M -27.75M -1.2B	279M 8.47M 7.55M 6.92M 6.29M 11.83M 800M 12.1M 82.73M 33.16M 424M 31.79M 31.11M 1.34B