PDF Solutions, Inc. and proteanTecs announced a collaboration on combined semiconductor analytics solutions intended to provide deeper insights on yield, quality and reliability by integrating proteanTecs deep agent and analytics solutions with the Exensio Platform. PDF Solutions and proteanTecs bring to the collaboration complementary expertise and market knowledge that combines PDF Solutions' process characterization and semiconductor big data analytics solutions, with proteanTecs' deep data offering for chip and system lifecycle analytics. Through this collaboration, proteanTecs and PDF Solutions intend to offer combined solutions that leverage each company's strengths, to enable data-driven insights and visibility in all stages of manufacturing.

The collaboration includes PDF Solutions' Exensio® Analytics platform, advanced AI/ML models and DEX™ data exchange network, and proteanTecs' agents with cloud/edge analytics based on ML-driven chip telemetry. The combined solutions are intended to deliver unique benefits, such as adaptive test capabilities to further improve test quality and reduce DPPM (defective parts per million), enhanced device quality grading for downstream testing, and more insights around RMAs (return material authorizations) from in-field degradation monitoring.