Onto Innovation Inc. announced the availability of its new Dragonfly® G3 inspection platform designed to meet the most advanced 2D and 3D sensitivity requirements for advanced packaging and specialty device manufacturers. The first Dragonfly G3 system was delivered to a leading OSAT partner in the fourth quarter of 2020. Orders received from a leading CMOS image sensor (CIS) manufacturer will be shipped in the first quarter of 2021 along with additional evaluation units to logic and memory customers. The Dragonfly G3 platform includes a newly designed optical system with sub-micron resolution, greatly improving 2D defect detection capability in either bright field, dark field or Clearfind® illumination modes. In addition to greater sensitivity, the system scans more than 30% faster than the previous platform. It also utilizes a redesigned 3D metrology system called the LT-200, using a revolutionary dual head design that improves the 3D bump measurement throughput up to 50%. Onto Innovation software further differentiates this solution with Discover® Defect software, which provides a process control suite in real time for an expanding range of complex applications in 5G, high-performance computing, and complex DRAM packages. With its increased scale, Onto Innovation is supporting customers with timely solutions to achieve their product development and production. By working collaboratively with customers, the new Dragonfly G3 inspection platform has already demonstrated it meets current and near future requirements for both 2D inspection and 3D metrology.