Ohishi Sangyo Co., Ltd. Share Price Fukuoka Stock Exchange

Equities

3943

JP3174800007

Paper Packaging

Market Closed - Fukuoka Stock Exchange 01:00:00 04/07/2023 BST 5-day change 1st Jan Change
2,080 JPY +15.04% Intraday chart for Ohishi Sangyo Co., Ltd. -.--% -.--%

Financials

Sales 2022 19.75B 127M 10.07B Sales 2023 21.79B 140M 11.11B Capitalization 7.01B 44.92M 3.58B
Net income 2022 1.06B 6.76M 539M Net income 2023 902M 5.78M 460M EV / Sales 2022 0.02 x
Net cash position 2022 6.43B 41.18M 3.28B Net cash position 2023 6.17B 39.53M 3.15B EV / Sales 2023 0.04 x
P/E ratio 2022
6.47 x
P/E ratio 2023
7.77 x
Employees 545
Yield 2022
3.39%
Yield 2023
3.53%
Free-Float 59.41%
More Fundamentals * Assessed data
Dynamic Chart
Ohishi Sangyo Co., Ltd. Reports Earnings Results for the Full Year Ended March 31, 2023 CI
Tranche Update on Ohishi Sangyo Co., Ltd.'s Equity Buyback Plan announced on June 25, 2015. CI
Tranche Update on Ohishi Sangyo Co., Ltd.'s Equity Buyback Plan announced on June 25, 2015. CI
Tranche Update on Ohishi Sangyo Co., Ltd.'s Equity Buyback Plan announced on June 25, 2015. CI
Tranche Update on Ohishi Sangyo Co., Ltd.'s Equity Buyback Plan announced on June 25, 2015. CI
Ohishi Sangyo Co., Ltd. announces an Equity Buyback for 500,000 shares, representing 6.24% for ¥350 million. CI
Ohishi Sangyo Co., Ltd. authorizes a Buyback Plan. CI
Tranche Update on Ohishi Sangyo Co., Ltd.'s Equity Buyback Plan announced on June 24, 2014. CI
Ohishi Sangyo Co., Ltd.’s Equity Buyback announced on June 24, 2014 has expired with 0 shares, representing 0% for ¥0 million. CI
Tranche Update on Ohishi Sangyo Co., Ltd.'s Equity Buyback Plan announced on June 24, 2014. CI
Tranche Update on Ohishi Sangyo Co., Ltd.'s Equity Buyback Plan announced on June 24, 2014. CI
Sanwa Co., Ltd. announced that it has received funding from Ohishi Sangyo Co., Ltd. CI
Sanwa Co., Ltd. announced that it expects to receive funding from Ohishi Sangyo Co., Ltd. CI
Tranche Update on Ohishi Sangyo Co., Ltd.'s Equity Buyback Plan announced on June 24, 2014. CI
Tranche Update on Ohishi Sangyo Co., Ltd.'s Equity Buyback Plan announced on June 24, 2014. CI
More news
Managers TitleAgeSince
Chairman 70 01/06/74
President 65 28/02/82
Director/Board Member 65 31/03/83
Members of the board TitleAgeSince
Director/Board Member 66 31/05/14
Chairman 70 01/06/74
Director/Board Member 68 28/02/79
More insiders
OHISHI SANGYO CO., LTD. is a Japan-based company principally engaged in the manufacture and sale of packaging-related materials. The Company operates in three business segments. The Cushioning Function Materials segment mainly manufactures and sells pulpy molds, corrugated boards and other materials with cushioning function. The Packaging Function Materials segment mainly manufactures and sells packaging-related materials, including paper bags and synthetic resin products. The Others segment is involved in the sale of information processing equipment, the development and sale of software and design-related business, as well as the leasing of real estate properties.
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