Sanwa Co., Ltd. announced that it has received funding from Ohishi Sangyo Co., Ltd.
December 04, 2014
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Sanwa Co., Ltd. announced a private placement of 30,000 common shares with new investor, Ohishi Sangyo Co., Ltd., on November 26, 2014. The investor will acquire a 4.76% stake in the company through the transaction. The transaction is planned to become effective on December 5, 2014.
On December 5, 2014, Sanwa Co., Ltd closed the transaction.
OHISHI SANGYO CO., LTD. is a Japan-based company principally engaged in the manufacture and sale of packaging-related materials. The Company operates in three business segments. The Cushioning Function Materials segment mainly manufactures and sells pulpy molds, corrugated boards and other materials with cushioning function. The Packaging Function Materials segment mainly manufactures and sells packaging-related materials, including paper bags and synthetic resin products. The Others segment is involved in the sale of information processing equipment, the development and sale of software and design-related business, as well as the leasing of real estate properties.
OHISHI SANGYO CO., LTD. 
