NICHE-TECH SEMICONDUCTOR MATERIALS LIMITED

Niche-Tech Semiconductor Materials Limited

8490

KYG6541R1065

Specialty Mining & Metals

Market Closed - Hong Kong S.E. Other stock markets 09:08:17 17/05/2024 BST			5-day change	1st Jan Change
0.14 ^HKD	0.00%		-6.67%	+0.72%

04-18	Niche-Tech Semiconductor Materials Limited Not to Recommend the Payment of Final Dividend for the Year Ended 31 December 2023	CI
03-28	Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Full Year Ended December 31, 2023	CI

Niche-Tech Group Limited has Changed its Name to Niche-Tech Semiconductor Materials Limited

September 07, 2022 at 05:00 am

On September 07, 2022, Niche-Tech Group Limited changed its name to Niche-Tech Semiconductor Materials Limited.

Latest news about Niche-Tech Semiconductor Materials Limited

Niche-Tech Semiconductor Materials Limited Not to Recommend the Payment of Final Dividend for the Year Ended 31 December 2023	04-18	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Full Year Ended December 31, 2023	03-28	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	11-08	CI
Niche-Tech Semiconductor Materials Limited Announces Not Recommend an Interim Dividend for the Year Ending 31 December 2023	11/08/23	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	09/08/23	CI
Niche-Tech Semiconductor Materials Limited Approves Final Dividend for the Ended 31 December 2022	14/06/23	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the First Quarter Ended March 31, 2023	08/05/23	CI
Niche-Tech Semiconductor Materials Limited Proposes Ordinary Final Dividend for the Year Ended December 31, 2022, Payable on July 13, 2023	25/04/23	CI
Niche-Tech Group Limited Proposes Final Dividend for the Year Ended December 31, 2022, Payable on 13 July 2023	24/03/23	CI
Niche-Tech Semiconductor Materials Limited Provides Unaudited Consolidated Earnings Guidance for the Year Ended 31 December 2022	13/03/23	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	08/11/22	CI
Niche-Tech Group Limited has Changed its Name to Niche-Tech Semiconductor Materials Limited	07/09/22	CI
Niche-Tech Group Limited Announces Declaration of Interim Dividend for the Year Ending 31 December 2022, Payable on October 14, 2022	09/08/22	CI
Niche-Tech Group Limited Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	09/08/22	CI
Niche-Tech Group Limited Provides Preliminary Unaudited Consolidated Group Earnings Guidance for the Six Months Ended 30 June 2022	28/07/22	CI
Niche-Tech Group Limited Approves Final Dividend for the Year Ended 31 December 2021	15/06/22	CI
Niche-Tech Group Limited Proposes Final Dividend for the Year Ended December 31, 2021	12/05/22	CI
Niche-Tech Group Limited Reports Earnings Results for the First Quarter Ended March 31, 2022	06/05/22	CI
Niche-Tech Group Limited Provides Earnings Guidance for the Three Months Ended 31 March 2022	27/04/22	CI
Niche-Tech Group Limited Proposes Final Dividend for the Year Ended December 31, 2021, Payable on July 8, 2022	24/03/22	CI
Niche-Tech Group Limited Reports Earnings Results for the Full Year Ended December 31, 2021	24/03/22	CI
Niche-Tech Group Limited Provides Group Earnings Guidance for the Year Ended 31 December 2021	15/03/22	CI
Niche-Tech Group Limited Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	08/11/21	CI
Niche-Tech Group Limited Provides Earnings Guidance for the Nine Months Ended 30 September 2021	28/10/21	CI
Niche-Tech Group Limited Declares Interim Dividend for the Year Ending 31 December 2021, Payable on or Around 3 September 2021	13/08/21	CI

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Niche-Tech Semiconductor Materials Ltd, formerly Niche-Tech Group Limited, is an investment holding company mainly engaged in the semiconductor packaging materials business. The Company is engaged in the development, production and sale of bonding wires, encapsulants and other products. The bonding wires include palladium plated copper wires, silver alloy wires, copper alloy wires, silicon aluminum wires, gold alloy wires and other products. The encapsulants include light-emitting diode (LED) encapsulation silicone, epoxy and other products. The Company is also engaged in the production and sale of die attach adhesives, soldering materials and other products.

Sector

Specialty Mining & Metals

Calendar

03/06/2024 - Annual General Meeting

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Sector Nonferrous Metal Processing

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