NICHE-TECH SEMICONDUCTOR MATERIALS LIMITED Niche-Tech Semiconductor Materials Limited Share Price
Equities
8490
KYG6541R1065
Specialty Mining & Metals
|
Market Closed -
Other stock markets
|
5-day change | 1st Jan Change | ||
| 0.157 HKD | 0.00% |
|
+3.97% | +12.95% |
| Sales 2022 | 218M 27.83M 2.23B | Sales 2023 | 213M 27.15M 2.17B | Capitalization | 98.06M 12.53M 1B |
|---|---|---|---|---|---|
| Net income 2022 | 8M 1.02M 81.77M | Net income 2023 | - 0 0 | EV / Sales 2022 | 0.82 x |
| Net Debt 2022 | 5.6M 715K 57.19M | Net Debt 2023 | 82M 10.47M 838M | EV / Sales 2023 | 0.85 x |
| P/E ratio 2022 |
20
x | P/E ratio 2023 |
193
x | Employees | 183 |
| Yield 2022 |
2.16% | Yield 2023 |
-
| Free-Float | 25.44% |
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| 1 week | +3.97% | ||
| Current month | +6.08% | ||
| 1 month | +6.08% | ||
| 3 months | -0.63% | ||
| 6 months | -10.29% | ||
| Current year | +12.95% |
1 week
0.13
0.16
1 month
0.130.16
Current year
0.120.17
1 year
0.120.23
3 years
0.120.48
5 years
0.120.64
10 years
0.120.74
| Managers | Title | Age | Since |
|---|---|---|---|
Yiwu Shi
CMP | Compliance Officer | 41 | 05/09/17 |
Yong Xiang Luo
CTO | Chief Tech/Sci/R&D Officer | 38 | 06/09/09 |
Kin Lung Tsoi
AUD | Comptroller/Controller/Auditor | 48 | 27/06/19 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Lai Yin Poon
BRD | Director/Board Member | 52 | 27/06/19 |
Chun Kit Tai
BRD | Director/Board Member | 41 | 07/05/18 |
Bok Hin Chow
FOU | Founder | 42 | 31/12/05 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 26/04/24 | 0.157 | 0.00% | 0 |
| 25/04/24 | 0.157 | +12.14% | 10,000 |
| 24/04/24 | 0.14 | -7.28% | 10,000 |
| 23/04/24 | 0.151 | 0.00% | 0 |
| 22/04/24 | 0.151 | 0.00% | 0 |
Delayed Quote Hong Kong S.E., April 26, 2024 at 09:08 am
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Niche-Tech Semiconductor Materials Ltd, formerly Niche-Tech Group Limited, is an investment holding company mainly engaged in the semiconductor packaging materials business. The Company is engaged in the development, production and sale of bonding wires, encapsulants and other products. The bonding wires include palladium plated copper wires, silver alloy wires, copper alloy wires, silicon aluminum wires, gold alloy wires and other products. The encapsulants include light-emitting diode (LED) encapsulation silicone, epoxy and other products. The Company is also engaged in the production and sale of die attach adhesives, soldering materials and other products.
Sector
Specialty Mining & Metals
Calendar
06/05/2024
- Q1 2024 Earnings Release (Projected)
| 1st Jan change | Capi. | |
|---|---|---|
| +12.95% | 14.15M | |
| -.--% | 7.15B | |
| -14.21% | 6.62B | |
| +4.59% | 4.24B | |
| -1.83% | 4.13B | |
| +30.12% | 3.92B | |
| -0.08% | 3.46B | |
| +34.50% | 3.44B | |
| -27.97% | 3.44B | |
| -16.86% | 2.56B |
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