Improved road safety: Infineon and Reality AI teach cars how to hear
May 18, 2021 at 11:41 am
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Improved road safety: Infineon and Reality AI teach cars how to hear
May 18, 2021| Market News
Munich, Germany - 18 May 2021 - Today's advanced driver assistance systems (ADAS) are based on cameras, radar or lidar. As a result, their target objects need to be within the line of sight to be recognized by the system. This, however, turns into a weakness when it comes to emergency vehicles - they can be heard much earlier than they can be seen and thus are invisible to ADAS for a longer time. To address this challenge, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) together with Reality AI created an advanced sensing solution giving vehicles the sense of hearing. This solution adds XENSIV™ MEMS microphones to existing sensor systems. It enables cars to 'see' around the corner and to warn about moving objects hidden in the blind spot or approaching emergency vehicles that are still too distant to see.
The new sensing solution, that will be showcased at Infineon's Virtual Sensor Experience, is based on XENSIV™ MEMS microphones in combination with AURIX™ microcontrollers (MCU) and Reality AI's Automotive See-With-Sound (SWS) system. Using machine learning-based algorithms, the system is able to detect emergency vehicles, cars and other road participants - even if they cannot be seen by drivers or detected by the sensors incorporated in the vehicles' ADAS. Machine learning also ensures that the country-specific sirens of emergency vehicles are recognized in all parts of the world.
The automotive-qualified XENSIV MEMS microphone IM67D130A has an increased operating temperature range from -40 °C to +105 °C allowing various use cases in harsh automotive environments. The low distortions (THD) and the high acoustic overload point (AOP) of 130 dB SPL enable the microphone to capture distortion-free audio signals in loud environments. This permits a reliable classification, even if the siren sound is hidden in high background or wind noise. This sound-base sensing technology can also enable other applications in vehicles such as road condition monitoring, damage detection or even predictive maintenance.
For processing the audio signal, the Reality AI software makes use of Infineon's AURIX TC3x family of MCUs which is widely used across multiple automotive applications. The scalable MCU family offers a range from one to six cores and up to 16 MB of Flash with functional safety up to ASIL-D according to the ISO26262 2018 standard and EVITA full cybersecurity. AURIX TC3x gives customers the performance and flexibility to implement XENSIV MEMS microphones in ADAS use-cases.
Availability
The XENSIV MEMS microphone IM67D130A can be ordered now in a PG-LLGA-5-4 package. More information is available at www.infineon.com/mems-microphones. The demonstrator will be presented at Infineon's Virtual Sensor Experience.
Infineon's Virtual Sensor Experience 2021
'Sensing the world with XENSIV sensor solution' - In today's increasingly smart world, sensors have become one of the most important components in connected, responsive and intuitive system designs. At the same time, the growing proliferation of sensor-enabled systems is creating demand for broader, more differentiated offerings as needs clearly differ from one design to another. The challenge lies in finding a sensor solution that is a perfect fit for specific systems, reliability and security needs. The Virtual Sensor Experience show gives an exclusive opportunity to explore the rich and ever-expanding XENSIV™ sensor portfolio that serves these needs. For registration please click here.
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INFATV202105-70
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Infineon's XENSIV™ MEMS microphones in combination with AURIX™ microcontrollers and Reality AI's Automotive See-With-Sound system improve the road safety. Using machine learning-based algorithms, the sensor system is able to detect emergency vehicles, cars and other road participants - even if they cannot be seen by drivers or detected by the sensors incorporated in the vehicles' ADAS.
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Infineon Technologies AG published this content on 18 May 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 18 May 2021 10:40:02 UTC.
Infineon Technologies AG is one of the world's leading manufacturers of semiconductors. The group's products include power semiconductors, sensors, microcontrollers, digital, mixed-signal and analog ICs, discrete semiconductor modules, switches, interface ICs, motor-controlling ICs, RF power transistors, voltage regulators, and electronic safety components. Net sales break down by area of activity as follows:
- automotive (50.5%): semiconductor products used in the automotive industry, and memory products for specific applications for automotive, industrial, information technologies, telecommunications and consumer electronics.
- power & sensor systems (23.3%): semiconductors for energy-efficient power supplies, mobile devices, mobile phone network infrastructures, human-machine interaction as well as applications with special demands on their robustness and reliability.
- industrial power control (13.5%): semiconductor products for the conversion of electrical energy for small, medium and high-power applications, used in the manufacturing, the low-loss transmission, the storage and the efficient use of electrical energy;
- connected secure systems (12.6%): semiconductors for networked devices, card-based applications, and government documents; microcontrollers for industrial, entertainment, and household applications, components for connectivity systems, various customer support systems;
- other (0.1%).
Net sales are distributed geographically as follows: Germany (12.4%), Europe/Middle East/Africa (14.4%), China/Hong Kong/Taiwan (32.3%), Japan (10.5%), Asia/Pacific (15.9%), the United States (12.1%) and Americas (2.4%).