CHIPBOND TECHNOLOGY CORPORATION

Press Releases Chipbond Technology Corporation

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6147

TW0006147002

End-of-day quote Taipei Exchange Other stock markets 23:00:00 09/05/2024 BST			5-day change	1st Jan Change
76.7 ^TWD	-1.41%		-1.54%	+6.09%

05-08	Chipbond Technology Corporation Announces Promotion of Huoo-Wen Gau as CEO	CI
05-08	Chipbond Technology Corporation Announces President Changes	CI

Press Releases

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E Ink ecosystem partnerships to develop next-gen ePaper shelf labels	04-16	AQ
Chipbond Technology : The Company announced Board has approved Q2 of 2022 consolidated financial report	29/07/22	PU
Chipbond Technology : To announce Chairman of the Company set up the ex-dividend record date.	17/06/22	PU
Chipbond Technology : To announce the Company acquires a batch of NT$500 million machinery equipment	09/06/22	PU
Chipbond Technology : The Company announced Board has approved Q1 of 2022 consolidated financial report	29/04/22	PU
Chipbond announces supplemental information on 2022 Annual General Shareholders' Meeting (Method of Convening the Meeting: Physical Shareholders' Meeting)	15/04/22	PU
Chipbond Technology : Board Meeting Resolution on dividend distribution	15/04/22	PU
Chipbond Technology : To announce the Company acquires a batch of NT$500 million machinery equipment	22/03/22	PU
Chipbond Technology : The Company announced Board has approved Q4 of 2021 consolidated financial report	25/02/22	PU
Chipbond Technology : Board of Directors resolved to convene 2022 Annual Shareholders' Meeting	25/02/22	PU

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