Today's Information

Provided by: CHIPBOND TECHNOLOGY CORPORATION
SEQ_NO 1 Date of announcement 2022/02/25 Time of announcement 16:09:49
Subject
 Chipbond Board of Directors resolved to
convene 2022 Annual Shareholders' Meeting
Date of events 2022/02/25 To which item it meets paragraph 17
Statement
1.Date of the board of directors resolution:2022/02/25
2.General shareholders' meeting date:2022/05/27
3.General shareholders' meeting location:
8F, No. 10, Zhanye 1st Road, Hsinchu Science Park,
Hsinchu City, Taiwan (Prosperity Plant 8F)
4.Cause for convening the meeting I.Reported matters:
(1) To report the business of 2021
(2) Audit Committee's review report on the FY 2021 audited financial
statements
(3) To report FY 2021 Directors' remuneration and Employees' compensation
(4) To report the proposal for the cash distribution of 2021 profits
(5) To report the proposal for the cash distribution from capital surplus
5.Cause for convening the meeting II.Acknowledged matters:
(1) To accept 2021 Business Report and Financial Statements
(2) To accept the proposal for the distribution of 2021 profits
6.Cause for convening the meeting III.Matters for Discussion:
(1) To release the newly elected Directors from non-competition restrictions.
(2) To Amend the Company's "Operational Procedures for Acquisition and
 Disposal of Assets"
7.Cause for convening the meeting IV.Election matters:
(1) To hold the by-election of director.
8.Cause for convening the meeting V.Other Proposals:None
9.Cause for convening the meeting VI.Extemporary Motions:None
10.Book closure starting date:2022/03/29
11.Book closure ending date:2022/05/27
12.Whether to announce proposal for profit distribution
or loss off-setting in "Status of dividend distribution
" section of MOPS:No
13.Please explain the reason for not announcing proposal
for profit distribution or loss off-setting:
The board of directors has not resolved yet.
14.Any other matters that need to be specified:None

Attachments

  • Original Link
  • Original Document
  • Permalink

Disclaimer

Chipbond Technology Corporation published this content on 25 February 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 25 February 2022 08:21:04 UTC.