Valuation: China Wafer Level CSP Co., Ltd.

Capitalization 21.93B 3.23B 2.76B 2.53B 2.39B 4.42B 309B 4.45B 30.08B 11.71B 147B 12.12B 11.86B 510B P/E ratio 2024
72.4x
P/E ratio 2025 48.5x
Enterprise value 21.93B 3.23B 2.76B 2.53B 2.39B 4.42B 309B 4.45B 30.08B 11.71B 147B 12.12B 11.86B 510B EV / Sales 2024
-
EV / Sales 2025 -
Free-Float
83.28%
Yield 2024 *
-
Yield 2025 -
1 day+3.99%
1 week+8.23%
Current month+8.23%
1 month+20.21%
3 months+4.44%
6 months+19.45%
Current year+21.69%
1 week 31.37
Extreme 31.37
33.8
1 month 28.32
Extreme 28.32
33.8
Current year 25.92
Extreme 25.92
35.84
1 year 25.36
Extreme 25.36
35.84
3 years 13.44
Extreme 13.44
38.2
5 years 13.44
Extreme 13.44
40.19
10 years 5.14
Extreme 5.1376
55.21
Manager TitleAgeSince
Chief Executive Officer 60 30/04/2005
Director of Finance/CFO 47 02/09/2010
Corporate Officer/Principal 57 19/01/2011
Director TitleAgeSince
Chairman 60 30/04/2005
Director/Board Member 57 22/06/2015
Director/Board Member 61 14/06/2022
Change 5d. change 1-year change 3-years change Capi.($)
+3.99%+8.23%+14.57%+47.57% 3.1B
+4.83%+1.69%+94.09%+122.80% 571B
+2.14%-0.86%+245.60%+433.47% 362B
-1.57%+8.20%+124.29%+213.14% 149B
-1.26%+5.38%+285.92%+432.04% 76.89B
-2.30%-1.02%+187.58%+131.30% 24.71B
-0.44%-7.43%+73.53%+57.45% 22.16B
+1.62%-3.48%+271.75%+241.12% 18.21B
+0.24%-5.60%+179.85%+197.07% 13.83B
-0.50%+0.90%+749.86%+1,172.27% 14.37B
Average +0.68%+2.65%+222.70%+304.82% 125.53B
Weighted average by Cap. +2.55%+4.10%+165.39%+255.37%

Financials

2024 2025
Net sales 1.13B 166M 142M 130M 123M 228M 15.92B 229M 1.55B 604M 7.56B 624M 611M 26.27B 1.47B 217M 185M 170M 161M 297M 20.77B 299M 2.02B 787M 9.86B 814M 797M 34.26B
Net income 253M 37.22M 31.79M 29.12M 27.53M 50.98M 3.56B 51.25M 347M 135M 1.69B 140M 137M 5.88B 370M 54.43M 46.48M 42.59M 40.26M 74.56M 5.21B 74.94M 507M 197M 2.47B 204M 200M 8.59B
Net Debt - -
Logo China Wafer Level CSP Co., Ltd.
China Wafer Level CSP Co Ltd is a China-based company mainly engaged in packaging and testing business in the field of sensors. The Company's packaging products mainly include image sensor chips, biometric identification chips, and others. These products are mainly used in electronic fields such as mobile phones, security monitoring, identity recognition, automotive electronics, and three-dimensional (3D) sensing. The Company is also engaged in the design and development of optical devices, and related products are mainly used in semiconductor equipment, industrial intelligence, automotive intelligent projection and other fields. The Company principally conducts its businesses in domestic and overseas markets.
Employees
1,088
Date Price Change Volume
12/05/26 33.66 ¥ +3.99% 55,191,750
12/05/26 32.37 ¥ -1.67% 38,487,730
11/05/26 32.92 ¥ +2.65% 63,915,300
08/05/26 32.07 ¥ -1.05% 37,146,390
07/05/26 32.41 ¥ +2.66% 45,440,410
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
33.66CNY
Average target price
29.40CNY
Spread / Average Target
-12.66%

Annual profits - Rate of surprise

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