Vishay Intertechnology : IGBT Power Modules Increase Efficiency and Reduce Conduction Losses in TIG Welding Machines
January 19, 2016 at 02:24 pm
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MALVERN, Pa. - Jan. 19, 2016 - Vishay Intertechnology, Inc. (NYSE: VSH) today introduced four new half-bridge and single-switch IGBT power modules designed specifically for TIG welding machines. Built on Vishay's proprietary Trench PT IGBT technology, the VS-GP100TS60SFPBF, VS-GP250SA60S, VS-GP300TD60S, and VS-GP400TD60S provide extremely low collector-to-emitter voltages down to 1.10 V and turn-off switching energy down to 11 mJ for output inverter stages.
With their Trench PT IGBT construction, the Vishay Semiconductors devices released today achieve a smaller size than planar IGBTs, providing designers with higher current density and lower thermal resistance (junction-to-case) without compromising on performance. The devices' low collector-to-emitter voltage enables extremely low conduction losses, while their turn-off switching energy is 50 % lower than previous-generation devices for increased efficiency and long-term reliability.
The half-bridge VS-GP100TS60SFPBF, VS-GP300TD60S, and VS-GP400TD60S combine Trench PT IGBTs with HEXFRED® and FRED Pt® anti-parallel diodes in the INT-A-PAK package and dual INT-A-PAK package with an extremely low profile of 17 mm. The single-switch VS-GP250SA60S features the SOT-227 package, provides very low stray inductance of ≤ 5 nH typical, and is UL-approved file E78996.
The RoHS-compliant modules feature operating frequencies to 1 kHz, 600 V collector-to-emitter voltages, and continuous collector current from 100 A to 400 A. The devices can be directly mounted to heatsinks and offer low EMI to reduce snubbing requirements.
Device Specification Table:
Part #
VS-GP100TS60SFPbF
VS-GP250SA60S
VS-GP300TD60S
VS-GP400TD60S
I
100 A
250 A
300 A
400 A
V
1.16 V
1.10 V
1.30 V
1.30 V
Package
INT-A-PACK
SOT-227
DIAP, low profile
DIAP, low profile
E
15.3 mJ
11 mJ
33 mJ
45 mJ
Circuit
Half bridge
Single switch
Half bridge
Half bridge
IGBT
Trench PT
Trench PT
Trench PT
Trench PT
Diode
FRED Pt
None
HEXFRED
HEXFRED
Samples and production quantities of the new IGBT power modules are available now, with lead times of eight to 10 weeks for larger orders.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay's product innovations, successful acquisition strategy, and 'one-stop shop' service have made it a global industry leader. Vishay can be found on the Internet at www.vishay.com.
Vishay Intertechnology Inc. issued this content on 2016-01-19 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 2016-01-19 14:23:04 UTC
Original Document: http://www.vishay.com/company/press/releases/2016/160119PowerModules/
Vishay Intertechnology, Inc. (Vishay) is engaged in manufacturing a portfolio of discrete semiconductors and passive electronic components, which supports designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Vishay designs, manufactures, and markets electronic components that cover a range of functions and technologies. Its products include commodity, non-commodity, and custom products. Vishayâs brands include Siliconix, Dale, Draloric, Beyschlag, Sfernice, MCB, UltraSource, Applied Thin-Film Products, IHLP, HiRel Systems, Sprague, Vitramon, Barry, and BCcomponents. Vishayâs semiconductors products include metal oxide semiconductor field-effect transistors (MOSFETs), diodes, and optoelectronic components. The Companyâs semiconductor components are used for a variety of functions, including power control, power conversion, signal switching, signal routing, signal blocking, two-way data transfer, and circuit isolation.