VIA Technologies, Inc.

2388

TW0002388006

Semiconductors

End-of-day quote Taiwan S.E. Other stock markets 23:00:00 09/05/2024 BST			5-day change	1st Jan Change
113.5 ^TWD	-6.58%		-8.10%	-27.48%

03-14	VIA Technologies, Inc. Reports Earnings Results for the Full Year Ended December 31, 2023	CI
03-06	VIA Technologies, Inc. announced that it expects to receive TWD 300 million in funding	CI

VIA Technologies, Inc. Announces for Cash Dividend

March 08, 2022 at 08:10 am

VIA Technologies, Inc. announced cash dividend TWD 495,349,941, each common share is entitled to receive TWD 1 per share. Ex-rights (ex-dividend) trading date: April 7, 2022, Ex-rights (ex-dividend) record date: April 13, 2022. Book closure ending date: April 13, 2022.

Latest news about VIA Technologies, Inc.

VIA Technologies, Inc. Reports Earnings Results for the Full Year Ended December 31, 2023	03-14	CI
VIA Technologies, Inc. announced that it expects to receive TWD 300 million in funding	03-05	CI
VIA Technologies, Inc. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	11-09	CI
VIA Technologies, Inc. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	10/08/23	CI
VIA Technologies, Inc. Announces the Appointment of Kou-Sheng Tseng as Member of Compensation Committee	03/08/23	CI
VIA Technologies, Inc. Announces Audit Committee Changes	16/06/23	CI
VIA Technologies, Inc. Announces Executive Changes	16/06/23	CI
VIA Technologies, Inc. Reports Earnings Results for the First Quarter Ended March 31, 2023	11/05/23	CI
VIA Technologies, Inc. Announces Cash Dividend, Payable on July 19, 2023	05/05/23	CI
VIA Technologies, Inc. Announces Resignation of Wen-Yuen Ken as Member of Audit Committee / Compensation Committee, Effective June 15, 2023	09/03/23	CI
Via Technologies, Inc. Announces Resignation of Wen-Yuen Ken as Independent Director, Effective June 15, 2023	09/03/23	CI
VIA Technologies, Inc. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	31/10/22	CI
VIA Technologies, Inc. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	04/08/22	CI
VIA Technologies, Inc. Reports Earnings Results for the First Quarter Ended March 31, 2022	03/05/22	CI
VIA Technologies, Inc. Reports Earnings Results for the Full Year Ended December 31, 2021	10/03/22	CI
VIA Technologies, Inc. Announces for Cash Dividend	08/03/22	CI
VIA Technologies, Inc. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	03/11/21	CI
Ennoconn Corporation announced that it has received TWD 1.5 billion in funding from VIA Labs, Inc., MediaTek Capital Co., VIA Technologies, Inc. and another investor	22/08/21	CI
Ennoconn Corporation announced that it expects to receive TWD 1.5 billion in funding from VIA Labs, Inc., MediaTek Capital Co., VIA Technologies, Inc.	10/08/21	CI
Via Technologies, Inc. Reports Earnings Results for the Second Quarter Ended June 30, 2021	30/07/21	CI
VIA Technologies, Inc. Announces Dividend Payable on September 17, 2021	20/07/21	CI
Via Technologies, Inc. Reports Earnings Results for the First Quarter Ended March 31, 2021	28/04/21	CI
Via Technologies, Inc. Reports Earnings Results for the Full Year Ended December 31, 2020	21/03/21	CI
Intel Not Inside : How Mobile Chips Overtook the Semiconductor Giant	12/12/20	DJ
Via Technologies, Inc. Reports Earnings Results for the Third Quarter Ended September 30, 2020	12/11/20	CI

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Company Profile

VIA Technologies, Inc. is a Taiwan-based company principally engaged in the design, research, development, manufacture and distribution of chips. The Companyâs products include central processing unit, logic chip, embedded control platform solution, Low-power multi-function system chip, x86 processor, multimedia control chip, digital electronic board player, industrial control fan-free system, Tablet PC, embedded module and peripheral accessories. The Company distributes its products within domestic market and to overseas markets.

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Semiconductors

Calendar

19/06/2024 - Annual General Meeting

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