Announcement for the acquisition of fixed income
securities on behalf of TSMC Global Ltd., a subsidiary
of TSMC
Date of events
2022/01/14
To which item it meets
paragraph 20
Statement
1.Name of the securities:
Agency Mortgage-Backed Securities.
2.Trading date:2022/01/14
3.Amount, unit price, and total monetary amount of the transaction:
3140QEXU1:129,557 units; US$101.05 per unit; Total amount: US$13.1 million.
4.Gain (or loss) through disposal (not applicable in case of acquisition of
securities):NA
5.Relationship with the underlying company of the trade:None
6.Current cumulative amount held, monetary amount, and shareholding
percentage of cumulative holdings of the securities being traded (including
the current trade), and status of any restriction of rights (e.g.pledges):
3140QEXU1:129,557 units; US$13.1 million; NA; None.
7.Current ratio of securities investment (including the current trade, as
listed in article 3 of Regulations Governing the Acquisition and Disposal of
Assets by Public Companies) to the total assets and equity attributable to
owners of the parent as shown in the most recent financial statement and
working capital as shown in the most recent financial statement as of the
present:
4.66%; 6.14%; NT$-99,580 million.
8.Concrete purpose of the acquisition or disposal:
Fixed income investment.
9.Any dissenting opinions of directors to the present transaction:NA
10.Whether the counterparty of the current transaction is a related party:No
11.Trading counterparty and its relationship with the Company:NA
12.Date of the board of directors resolution:NA
13.Date of ratification by supervisors or approval by
the audit committee:NA
14.Any other matters that need to be specified:None
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TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 14 January 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 14 January 2022 09:31:06 UTC.
Taiwan Semiconductor Manufacturing Co Ltd is a Taiwan-based company mainly engaged in the provision of integrated circuit manufacturing services. The integrated circuit manufacturing services include process technology, special process technology, design ecosystem support, mask technology, 3DFabricTM advanced packaging and silicon stacking technology services. The Company has completed the transfer and mass production of 5nm technology, and is engaged in the research and development of 3nm process technology and 2nm process technology. The product application range covers the entire electronic application industry, including personal computers and peripheral products, information application products, wired and wireless communication system products, servers and data centers.