Taiwan Semiconductor Manufacturing Company Limited | |||||
('TSMC'; NYSE: TSM) | |||||
This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) The unsecured bonds issued by TSMC and its subsidiaries for the month of April 2021. | |||||
1. The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: | |||||
Title | Name | Number of shares held as of | Changes | ||
3/31/2021 | 4/30/2021 | ||||
Senior Vice President | Cliff Hou | 437,576 | 437,905 | 329 | |
Vice President | Marvin Liao | 310,485 | 315,485 | 5,000 | |
Vice President and Chief Financial Officer | Wendell Huang | 1,651,630 | 1,651,638 | 8 | |
Vice President | Jun He | 6,000 | 7,000 | 1,000 | |
Note: Shareholdings include shares held by the related parties. | |||||
2. The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: Inapplicable | |||||
3. The acquisition and disposition of assets by TSMC and its subsidiaries: | |||||
Fixed-income investment: NT$26.5 billion of acquisition and NT$8.2 billion of disposition. | |||||
4. The capital appropriations approved by TSMC board of directors: | |||||
(1) Machinery equipment for mature technology capacity: NT$69.9 billion; | |||||
(2) Real estate and capitalized leased assets: NT$9.5 billion. | |||||
5. The unsecured bonds issued by TSMC and its subsidiaries: | |||||
Overseas US$ Unsecured Bond | |||||
Issuance Period |
Total Amount |
Coupon | Repayment
and | ||
April 2021 ~ April 2026 | US$1.1 | 1.25% | Bullet repayment (callable at any time, in whole or in part, at the relevant redemption price according to relevant agreements); interest payable semi-annually | ||
April 2021 ~ April 2028 | US$0.9 | 1.75% | |||
April 2021 ~ April 2031 | US$1.5 | 2.25% | |||
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TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 25 May 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 25 May 2021 10:08:04 UTC.