Signetics Korea Co., Ltd. announced that it has approved capital expenditure plans and has ordered equipment that will double their capacity for Flip Chip Package Assembly at their factory in Paju, South Korea. The new Flip Chip expansion will be qualified by January 2013 and will be ready for volume production in February 2013. The centerpiece of this new equipment is the Quantum 8800 Flip Chip bonder by Datacon.

This bonder allows for finer bump pitches below 100um and is compatible with the 95mm PCB format. Signetics offers a broad range of Flip Chip Packaging options that use industry standard bumping technologies as well as the finer pitch copper pillar bumping technology. Substrates used for Flip Chip Packaging at Signetics include both PBGA and FBGA as well as leadframe technologies such as QFN.

Flip Chip assembly is offered in multi die or system-in-package configurations and hybrid configurations with both wirebond and flip chip connectivity for new applications that require more and more system integration in a single package.