Signetics Corporation

A033170

KR7033170002

Semiconductors

End-of-day quote Korea S.E. Other stock markets 23:00:00 19/05/2024 BST			5-day change	1st Jan Change
1,652 ^KRW	-0.48%		-1.08%	+33.66%

2022	Signetics Corporation agreed to acquire 6.82629% stake in Interflex Co., Ltd. for KRW 15 billion.	CI
2013	Interflex Co., Ltd. cancelled the sale of 12.52% stake in Signetics Korea Co., Ltd..	CI

Signetics Corporation agreed to acquire 6.82629% stake in Interflex Co., Ltd. for KRW 15 billion.

October 19, 2022

Signetics Corporation (KOSDAQ:A033170) agreed to acquire 6.82629% stake in Interflex Co., Ltd. (KOSDAQ:A051370) for KRW 15 billion on October 20, 2022. The consideration will be paid in cash. Transaction is expected to close on October 20, 2022.

Latest news about Signetics Corporation

Signetics Corporation agreed to acquire 6.82629% stake in Interflex Co., Ltd. for KRW 15 billion.	19/10/22	CI
Interflex Co., Ltd. cancelled the sale of 12.52% stake in Signetics Korea Co., Ltd..	25/10/13	CI
Signetics Corporation Introduces New MapBGA Package	10/03/13	CI
Signetics Korea Plans to Double Flip Chip Package Assembly Capacity to Support Smartphones and Other Fast Growing Consumer Applications	02/12/12	CI
Interflex Co., Ltd. agreed to sell 12.52% stake in Signetics Korea Co., Ltd. for KRW 30 billion.	25/10/12	CI

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Company Profile

Signetics Corp. is a Korea-based company principally engaged in the semiconductor packaging business. The Company provides laminate packages, tape packages, lead frame packages and flip chip packages for applications in the communication, consumer and computing markets. Its laminate packages include fine pitch ball grid array (FBGA), board on chip (BOC), stacked die chip scale package (CSP), plastic BGA (PBGA), heat spreader PBGA, enhanced PBGA and fine pitch land grid array (FLGA). Its tape packages include tape BGA and thin fine BGA. Its lead frame packages include metric, low-profile and thin quad flat package (QFP), thin-shrink small outline package (TSSOP), thin small-outline packages (TSOP) and quad flat no-lead (QFN). Its flip chip packages include flip chip BGA (FCBGA) and flip-chip chip scale package (FCCSP).

Sector

Semiconductors

Calendar

12/08/2024 - Q2 2024 Earnings Release (Projected)

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