Rambus Announces Tapeout of GDDR6 Memory PHY on TSMC 7nm Process Technology
January 30, 2019 at 02:00 pm
Share
Rambus Inc. announced the tapeout of its GDDR6 PHY on TSMC 7nm FinFET process technology and is available from Rambus for licensing today. Leveraging almost 30 years of high-speed interface design expertise and using advanced process technology, Rambus has successfully taped out a GDDR6 PHY IP on TSMC 7nm process technology. With ongoing engagements among design and verification customers, GDDR6 is applicable to a broad range of high-performance applications including networking, data center, advanced driver assistance systems (ADAS), machine learning and artificial intelligence (AI). This fastest discrete memory interface from Rambus will add to TSMC’s large portfolio of silicon proven intellectual property (IP), design tools and reference flows. Expanding beyond traditional GPU and graphic applications, GDDR6 helps to address market needs in multiple, high-bandwidth applications, as memory performance becomes more critical for overall system performance. This latest addition to the Rambus high-speed-interface IP portfolio highlights the company’s leadership and long tradition of signal- and power-integrity expertise, remaining at the forefront of innovation in interface technology. By providing the highest speed of up to 16 Gbps, while utilizing established packaging and testing techniques, GDDR6 offers system designers an alternative memory choice that is five times faster than traditional memory available today. The Rambus GDDR6 offering will also add to TSMC’s portfolio of silicon-proven IP, via its Open Innovation Platform® (OIP) IP Alliance Program. In this program, TSMC’s IP and ecosystem partners like Rambus are able to tapeout and validate in silicon critical IP for TSMC's various process nodes. Benefits of the Rambus GDDR6 PHY: Provides the speed of up to 16 Gbps, providing a maximum bandwidth of up to 512 Gbps; Offers PCB and Package design support – allowing customers to quickly and reliably bring their high-speed designs to production; Delivers a timing-closed hard macro solution for easy ASIC integration; Provides access to Rambus system and SI/PI experts helping ASIC designers to ensure maximized signal and power integrity for devices and systems; Presents a LabStation™ development environment that enables quick system bring-up, characterization and debug; Supports high-performance applications including networking, data center, ADAS, machine learning and AI.
Rambus Inc. is a provider of chips, silicon intellectual property (IP) and innovations that address the fundamental challenges of accelerating data and enabling critical performance improvements for data center and other growing markets. It offers a balanced and diverse portfolio of solutions across chips, silicon IP and patent licensing. Its Rambus Double Data Rate (DDR) memory interface chips for server memory modules enable increased bandwidth and expanded capacity in enterprise and cloud servers. Its portfolio includes DDR5 and DDR4 memory interface chipsets. Its DDR5 chipset solution includes the Registering Clock Driver (RCD), Serial Presence Detect Hubs (SPD Hub) and Temperature Sensors (TS). Rambus Silicon IP includes interface and security IP solutions that move and protect data in advanced data center, government and automotive applications. It sells memory interface chips directly and indirectly to memory module manufacturers and original equipment manufacturers (OEMs).