Flex in collaboration with QuickLogic Corporation and Infineon Technologies AG announced the availability of the FLEXino Sensor Fusion Development Kit to enable rapid prototyping and a corresponding 12mm x 12mm System-in-Package (SiP) for high volume production of Internet of Things (IoT) devices. To help reduce time to market and scale production, the development kit and SiP enable a wide range of new and existing sensor fusion IoT products requiring audio, pressure and motion sensing, Bluetooth and WiFi capabilities. FLEXino Sensor Fusion Development Kit: The development kit contains an ESP32 controller board with Bluetooth and WiFi connectivity and a sensor fusion daughter board, created in collaboration with QuickLogic and Infineon.

The daughter board integrates QuickLogic's EOS™ S3 SoC platform with Infineon's DPS310 digital barometric pressure sensor and IM69D130 digital MEMS microphone in addition to a 6-axis IMU and a 64Mb SPI flash. Flexible throughout the design process and compatible with the Adafruit Feather ecosystem, the development kit is optimized for quick prototyping. The development kit is applicable across many industries due to its small, accessible form factor that integrates best-in-class sensors commonly used in a variety of industrial and consumer markets.

The hardware configuration addresses several use cases, as the sensor fusion algorithm is software configurable. System-in-Package (SiP): The SiP is a drop-in sensor fusion solution for IoT devices with constrained form factors. The System-in-Package offers a single integrated form factor (12 x 12mm) version of the sensor fusion daughter board that has been miniaturized at scale through Flex proprietary packaging processes.

The self-contained subsystem frees the selected host processor from always-on sensor fusion workloads. The Flex proprietary SiP form factor can be customized for different sensor fusion applications and easily integrates into new or existing products. Availability: The FLEXino Sensor Fusion Development Kit is available now, and the System-in-Package is scheduled to be available the first quarter of 2020.