Combining the best of both worlds: CoolSiC™ MOSFET and TRENCHSTOP™ IGBT in Easy 2B package boost system efficiency
July 19, 2019 at 10:55 am
Share
Munich, Germany - 19 July 2019 - Compared with traditional 3-level neutral-point-clamped topologies, the advanced neutral-point-clamped (ANPC) inverter design supports an even loss distribution between semiconductor devices. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) utilizes the ANPC topology for its hybrid SiC and IGBT power module EasyPACK™ 2B in the 1200 V family. Optimizing for sweet spot losses of the CoolSiC™ MOSFET and the TRENCHSTOP™ IGBT4 chipsets respectively, the module features increased power density and a switching frequency of up to 48 kHz. This is especially well suited for the needs of new generation 1500 V photovoltaic and energy storage applications.
The new ANPC topology supports a system efficiency of more than 99 percent. Implementing the hybrid Easy 2B power module in e.g. the DC/AC stage of a 1500 V solar string inverter allows for coils to be smaller than with devices with a lower switching frequency. It therefore weighs significantly less than a corresponding inverter with purely silicon components. Additionally, the losses with silicon carbide are smaller than with silicon. For this reason, less heat must be dissipated so that the heat sink can also shrink. Overall, this leads to smaller inverter housings and costs savings at system level. Compared to 5-level topologies, the 3-level design reduces complexity of the inverter design.
The Easy 2B standard package for power modules is characterized by an industry-leading low stray inductance. Additionally, the integrated body diode of the CoolSiC MOSFET chip ensures a low-loss freewheeling function without the need for another SiC diode chip. While the NTC temperature sensor facilitates the monitoring of the device, the PressFIT technology reduces assembly time for mounting the device.
Availability
The hybrid EasyPACK 2B (F3L11MR12W2M1_B65) can be ordered now. More information is available at www.infineon.com/coolsic-mosfet.
Attachments
Original document
Permalink
Disclaimer
Infineon Technologies AG published this content on 19 July 2019 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 19 July 2019 09:54:09 UTC
Infineon Technologies AG is one of the world's leading manufacturers of semiconductors. The group's products include power semiconductors, sensors, microcontrollers, digital, mixed-signal and analog ICs, discrete semiconductor modules, switches, interface ICs, motor-controlling ICs, RF power transistors, voltage regulators, and electronic safety components. Net sales break down by area of activity as follows:
- automotive (50.5%): semiconductor products used in the automotive industry, and memory products for specific applications for automotive, industrial, information technologies, telecommunications and consumer electronics.
- power & sensor systems (23.3%): semiconductors for energy-efficient power supplies, mobile devices, mobile phone network infrastructures, human-machine interaction as well as applications with special demands on their robustness and reliability.
- industrial power control (13.5%): semiconductor products for the conversion of electrical energy for small, medium and high-power applications, used in the manufacturing, the low-loss transmission, the storage and the efficient use of electrical energy;
- connected secure systems (12.6%): semiconductors for networked devices, card-based applications, and government documents; microcontrollers for industrial, entertainment, and household applications, components for connectivity systems, various customer support systems;
- other (0.1%).
Net sales are distributed geographically as follows: Germany (12.4%), Europe/Middle East/Africa (14.4%), China/Hong Kong/Taiwan (32.3%), Japan (10.5%), Asia/Pacific (15.9%), the United States (12.1%) and Americas (2.4%).