Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
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5-day change | 1st Jan Change | ||
18.02 HKD | +5.75% | +13.19% | -4.56% |
05-10 | Hua Hong Semiconductor's Q1 Profit Plunges 79% as Revenue Falls | MT |
05-09 | Hua Hong Semiconductor Limited Approves Final Dividend for the Year Ended 31 December 2023 | CI |
Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
1st Jan change | Capi. | |
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-4.56% | 4.82B | |
+81.49% | 2,212B | |
+35.24% | 641B | |
+19.40% | 618B | |
+3.06% | 246B | |
+25.89% | 203B | |
+9.73% | 170B | |
+42.07% | 134B | |
+44.84% | 112B | |
+4.35% | 103B |