GONGIN PRECISION IND. CO., LTD Gongin Precision Ind. Co., Ltd Share Price
Equities
3178
TW0003178000
Semiconductor Equipment & Testing
|
End-of-day quote
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|
5-day change | 1st Jan Change | ||
| 121 TWD | +1.26% |
|
-2.42% | +18.05% |
| Sales 2022 | 1.52B 46.6M 3.73B | Sales 2023 | 1.62B 49.85M 3.99B | Capitalization | 4.62B 142M 11.34B |
|---|---|---|---|---|---|
| Net income 2022 | 226M 6.94M 555M | Net income 2023 | 204M 6.26M 501M | EV / Sales 2022 | 2.35 x |
| Net Debt 2022 | 745M 22.87M 1.83B | Net Debt 2023 | 834M 25.61M 2.05B | EV / Sales 2023 | 3.36 x |
| P/E ratio 2022 |
12.6
x | P/E ratio 2023 |
22.7
x | Employees | - |
| Yield 2022 |
3.98% | Yield 2023 |
-
| Free-Float | 35.73% |
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* Assessed data
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| 1 day | +1.26% | ||
| 1 week | -2.42% | ||
| Current month | +1.68% | ||
| 1 month | +6.14% | ||
| 3 months | +14.15% | ||
| 6 months | +45.26% | ||
| Current year | +18.05% |
1 week
114.00
126.00
1 month
114.00137.50
Current year
93.50137.50
1 year
74.40137.50
3 years
49.70137.50
5 years
25.75137.50
10 years
13.00137.50
| Managers | Title | Age | Since |
|---|---|---|---|
Yu Hsin Su
CEO | Chief Executive Officer | - | 27/03/78 |
Shan Tai Su
DFI | Director of Finance/CFO | - | - |
Hung Yin Su
IRC | Investor Relations Contact | - | - |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Hsi Che Teng
BRD | Director/Board Member | - | 13/06/17 |
Yu Hsin Su
CEO | Chief Executive Officer | - | 27/03/78 |
Ju Chu Chu
BRD | Director/Board Member | - | - |
| Date | Price | Change | Volume |
|---|---|---|---|
| 26/04/24 | 121 | +1.26% | 1,518,741 |
| 25/04/24 | 119.5 | -0.83% | 1,948,906 |
| 24/04/24 | 120.5 | +2.99% | 3,272,785 |
| 23/04/24 | 117 | +1.74% | 672,533 |
| 22/04/24 | 115 | -7.26% | 1,459,801 |
End-of-day quote Taipei Exchange, April 25, 2024
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GONGIN PRECISION INDUSTRIAL CO.,LTD is a Taiwan-based company principally engaged in the precision processing and manufacture of key parts and components of panels, semiconductors and aerospace industry. The Companyâs main products include key components of display devices, key components of wafer equipment, key components of aerospace products, key components of integrated circuit (IC) packaged abrasives and equipment, energy components and others. The Company distributes its products in domestic market and to overseas markets, such as the rest areas of Asia, Europe and the Americas.
| 1st Jan change | Capi. | |
|---|---|---|
| +18.05% | 167M | |
| +25.49% | 169B | |
| +32.74% | 32.77B | |
| +31.53% | 31.67B | |
| -20.15% | 26.77B | |
| +27.65% | 22.95B | |
| -12.08% | 11.56B | |
| +122.37% | 9.62B | |
| +31.00% | 5.94B | |
| -19.16% | 5.07B |
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