DSB Co., Ltd. announced a private placement of 110,000 shares of its treasury common stock at a price of ¥646 per share for gross proceeds of ¥71,060,000 on April 20, 2018. The transaction included participation from CAREERLINK Co., Ltd. (TSE:6070). The company announced that it will incur issue expenses of ¥250,000 in the transaction.
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|
5-day change | 1st Jan Change | ||
2,515 JPY | -0.24% | +1.25% | +6.75% |
2023 | Careerlink Co., Ltd. Reports Earnings Results for the Full Year Ended March 31, 2023 | CI |
2021 | Careerlink Co., Ltd.(TSE:6070) added to S&P Global BMI Index | CI |
Annual profits - Rate of surprise
1st Jan change | Capi. | |
---|---|---|
+6.75% | 191M | |
+16.32% | 68.31B | |
+2.89% | 44.11B | |
-13.01% | 5.23B | |
+2.05% | 2.2B | |
-26.04% | 1.88B | |
+9.87% | 1.54B | |
-29.32% | 1.14B | |
-14.43% | 1.12B | |
+36.25% | 848M |
- Stock Market
- Equities
- 6070 Stock
- News Careerlink Co., Ltd.
- DSB Co., Ltd. announced that it has received ¥71.06 million in funding from CAREERLINK Co., Ltd.