Valuation: Axcelis Technologies

Market Cap 3.25B 2.82B 2.66B 2.41B 4.53B 312B 4.56B 31.79B 12.23B 158B 12.22B 11.95B 504B P/E 2026 *
37.1x
P/E 2027 * 21.8x
Enterprise Value 3.25B 2.82B 2.66B 2.41B 4.53B 312B 4.56B 31.79B 12.23B 158B 12.22B 11.95B 504B EV / Sales 2026 *
3.68x
EV / Sales 2027 * 3.29x
Free-Float
99.32%
Yield 2026 *
-
Yield 2027 * -
Manager TitleAgeSince
Chief Executive Officer 55 10/05/2023
Director of Finance/CFO 53 11/03/2026
Chief Operating Officer - -
Director TitleAgeSince
Director/Board Member 72 30/04/2015
Director/Board Member 69 12/05/2015
Director/Board Member 55 10/05/2023
Change 5-day change 1-year change 3-year change Capi.($)
-0.65%-9.17%+89.03%+145.43% 615B
-2.19%-16.72%+123.84%+328.25% 342B
-0.55%-9.29%+124.26%+138.52% 150B
-3.27%-4.67%+254.49%+412.55% 84.64B
+0.81%-0.75% - - 35.18B
-1.02%-10.22%+40.47%+37.69% 19.64B
+3.22%0.00%+113.31%+59.28% 19.99B
+0.29%-10.17%+99.75%+236.06% 14.81B
-3.25%-13.78%+108.28%+94.85% 12.27B
Average -0.73%-5.38%+119.18%+181.58% 143.74B
Weighted average by Cap. -1.13%-8.18%+113.76%+209.81%

Financials

2026 *2027 *
Net sales 884M 765M 724M 655M 1.23B 84.75B 1.24B 8.64B 3.32B 42.97B 3.32B 3.25B 137B 989M 856M 810M 733M 1.38B 94.85B 1.39B 9.66B 3.72B 48.09B 3.71B 3.63B 153B
Net income 86.34M 74.79M 70.72M 64.03M 120M 8.28B 121M 844M 325M 4.2B 324M 317M 13.39B 142M 123M 116M 105M 197M 13.6B 199M 1.39B 533M 6.89B 532M 521M 21.98B
Net Debt - -
Logo Axcelis Technologies
Axcelis Technologies, Inc. is primarily a producer of ion implantation equipment used in the fabrication of semiconductor chips in the United States, Europe, and Asia. The Company is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the enabling steps in the IC manufacturing process. The Company's products include High Current, Medium Energy, High Energy, Mid Current, and GSD Ovation. The Company's Purion H6 next generation high current ion implanters deliver process control by leveraging its spot beam architecture, optimized for the full spectrum of high-current applications. The Company's Purion H200 is its state-of-the-art single wafer high current medium energy implanter. Its Purion XE Series high energy ion implanters use RF Linear Accelerator (LINAC) technology. The Company's Purion M ion implanters offer the broadest spectrum of mid-current doses available.
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