Amtech Systems, Inc. Announces Management Changes, Effective December 6, 2018
November 29, 2018 at 09:01 pm
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Amtech Systems, Inc. and Fokko Pentinga, the Chief Executive Officer and President of the company, agreed on a transition of leadership of the company, pursuant to which Mr. Pentinga will step down as the Chief Executive Officer, President and a director of the company effective as of December 6, 2018 (the Effective Date). Mr. J.S. Whang, the company's Executive Chairman, has agreed to serve as Chief Executive Officer of the company effective December 6, 2018.
Amtech Systems, Inc. is a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications. The Company's segments include semiconductor, and material and substrate. The semiconductor segment is engaged in the supply of thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics and electro/mechanical assembly manufacturers. The material and substrate segment is engaged in the production of wafer cleaning equipment as well as substrate consumables and chemicals for lapping (fine abrading) and polishing of materials, such as silicon wafers for semiconductor products, sapphire wafers for light-emitting diode (LED) applications, and compound substrates, like silicon carbide (SiC) wafers, for power device applications.
AMTECH SYSTEMS, INC. 
