WINPAC Inc.

A097800

KR7097800007

Semiconductors

End-of-day quote Korea S.E. Other stock markets 23:00:00 23/05/2024 BST			5-day change	1st Jan Change
1,005 ^KRW	-2.43%		-3.64%	-37.23%

04-12	WINPAC Inc. announced that it expects to receive KRW 18.564682948 billion in funding	CI
2023	WINPAC Inc. announced that it has received KRW 12 billion in funding	CI

Kyoung-Hoon Lee acquired 2.75% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 2.6 billion.

January 11, 2016

Kyoung-Hoon Lee acquired 2.75% stake in WINPAC Inc. (KOSDAQ:A097800) from DSC Dream First Private Equity Fund for KRW 2.6 billion on January 5, 2016. Kyoung-Hoon Lee acquired 0.4 million shares of WINPAC Inc. for KRW 6606 per share.

Kyoung-Hoon Lee completed the acquisition of 2.75% stake in WINPAC Inc. (KOSDAQ:A097800) from DSC Dream First Private Equity Fund on January 5, 2016.

Latest news about WINPAC Inc.

WINPAC Inc. announced that it expects to receive KRW 18.564682948 billion in funding	04-11	CI
WINPAC Inc. announced that it has received KRW 12 billion in funding	01/08/23	CI
WINPAC Inc. announced that it expects to receive KRW 12 billion in funding	30/07/23	CI
WINPAC Inc. Reports Earnings Results for the First Quarter Ended March 31, 2023	15/05/23	CI
WINPAC Inc. announced that it has received KRW 11.99999955 billion in funding	16/10/22	CI
WINPAC Inc. announced that it expects to receive KRW 11.99999955 billion in funding	06/10/22	CI
ABOV Semiconductor Co., Ltd. completed the acquisition of14.34% stake in WINPAC Inc. from TLi Inc., Sensona Inc. and Dal-Soo Kim.	21/12/21	CI
WINPAC Inc. announced that it has received KRW 14.99999832 billion in funding from ABOV Semiconductor Co., Ltd.	16/11/21	CI
ABOV Semiconductor Co., Ltd. agreed to acquire 14.34% stake in WINPAC Inc. from TLi Inc., Sensona Inc. and Dal-Soo Kim for KRW 24 billion.	08/11/21	CI
WINPAC Inc. announced that it expects to receive KRW 14.99999832 billion in funding from ABOV Semiconductor Co., Ltd.	08/11/21	CI
WINPAC Inc. announced that it has received KRW 5 billion in funding	10/06/21	CI
WINPAC Inc. announced that it expects to receive KRW 5 billion in funding	08/06/21	CI
WINPAC Inc. announced that it expects to receive KRW 999.999 million in funding	13/08/19	CI
WINPAC Inc. announced that it has received KRW 6 billion in funding from Shinhan Investment Corp., Investment Arm and other investors	04/04/19	CI
WINPAC Inc. announced that it expects to receive KRW 6 billion in funding from Shinhan Investment Corp., Investment Arm	02/04/19	CI
WINPAC Inc. announced that it has received KRW 4.5 billion in funding from Sensona Inc.	16/08/17	CI
WINPAC Inc. announced that it expects to receive KRW 4.5 billion in funding from Sensona Inc.	13/08/17	CI
WINPAC Inc. cancelled the acquisition of 7.39% stake in Transdermal Specialties Global Inc.	11/04/17	CI
WINPAC Inc. agreed to acquire 7.39% stake in Transdermal Specialties Global Inc. for KRW 4.6 billion.	11/04/16	CI
WINPAC Inc. announced that it has received KRW 13 billion in funding from Kell Cosmetics Co., Ltd., Heartnex Co., Ltd., KTB Network Co., Ltd., Incheon City Gas Co., Ltd., and other investors.	17/02/16	CI
Bum-Seok Oh acquired an additional 0.68% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 670 million.	04/02/16	CI
Hye-Kyoung Yang, Sae-Hoon Yang and Soo-Hyun Choi acquired 2.73% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 2.8 billion.	04/02/16	CI
Soo-Hyun Choi, Bum-Seok Oh and Soon-Jin Kim acquired 3.41% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 3.4 billion.	04/02/16	CI
WINPAC Inc. announced that it expects to receive KRW 20 billion in funding from a group of investors.	03/02/16	CI
Kyoung-Hoon Lee acquired 2.75% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 2.6 billion.	11/01/16	CI

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Company Profile

WINPAC INC. is a Korea-based company mainly engaged in the semiconductor business. The Company provides package products and testing services. Its package products consist of fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP), flip chips, universal serial bus (USB) flash drive (UFD), solid state drive (SSD) and others. The Company offers testing on memory products, such as dynamic random-access memory (DRAM), static random-access memory (SRAM), flash and pseudo-static random-access memory (PSRAM). It also provides semiconductor test services. The Company provides its services with domestic market and to overseas markets.

Sector

Semiconductors

Calendar

12/08/2024 - Q2 2024 Earnings Release (Projected)

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