NOVOSENSE Microelectronics announced its participation in the Automotive Engineering Exposition 2024 YOKOHAMA. From May 22 to 24, at booth N62 in PACIFICO Yokohama, Japan, NOVOSENSE will showcase the latest additions to its solutions in automotive OBC/DC-DC, traction inverter, BMS, body control module, lighting, and thermal management systems. Additionally, the online exposition will be accessible from May 15 to June 5, allowing broader access to innovative offerings. NOVOSENSE will showcase how its innovative products can help automakers to develop smarter and safer automotive system: To support the trends of multi-node, high-speed, and high-stability in-vehicle communication, NOVOSENSE's automotive-grade CAN SIC, NCA1462-Q1, can achieve a transmission rate of 8Mbps in a star network, and maintain good signal quality with high EMC performance and patented ringing suppression function.

More channels are integrated on a single LED driver chip to support the increasing number of LED beads. NOVOSENSE's LED driver integrates up to 24 channels on a single chip, supporting stronger current driving capability and complete circuit protection functions. Thermal management systems are transitioning from distributed architectures to integrated architectures.

NOVOSENSE's highly integrated small motor driver SoC, NSUC1610, realizes efficient, real-time control of motor applications by integrating an ARM core MCU, a 4-way half-bridge driver, and a LIN interface on a single chip. It is widely used in electronic expansion valves, AGS, and electronic air vents.