Inactive Instrument

Shenzhen Danbond Technology Co.,Ltd.

002618

CNE1000016X8

Shenzhen Danbond Technology Co.,Ltd. Announces Final Cash Dividend on A Shares for the Year 2018, Payable on 12 July 2019

July 05, 2019 at 04:32 pm

Shenzhen Danbond Technology Co.,Ltd. announced a final cash dividend of CNY 0.05000 per 10 A shares (tax included) for the year 2018. Record Date is 11 June 2019, Ex-date is 12 July 2019 and Payment date is 12 July 2019.

Latest news about Shenzhen Danbond Technology Co.,Ltd.

Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2022	29/09/22	CI
Danbond Technology Booted From Shenzhen Bourse	23/06/22	MT
Shenzhen Danbond Technology Co.,Ltd. Announces Board Changes	07/06/22	CI
Shenzhen Danbond Technology Co.,Ltd.(SZSE:002618) dropped from Shenzhen Stock Exchange A Share Index	31/05/22	CI
Shenzhen Danbond Technology Co.,Ltd.(SZSE:002618) dropped from Shenzhen Stock Exchange Composite Index	30/05/22	CI
Danbond Technology’s Shares to Enter Delisting Transitional Period	26/05/22	MT
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022	29/04/22	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2021	27/10/21	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2021	25/08/21	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2021	28/04/21	CI
Shenzhen Danbond Technology Co.,Ltd.(XSEC:002618) dropped from S&P Global BMI Index	21/12/20	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2020	16/10/20	CI
Shenzhen Danbond Technology Co.,Ltd. Announces Final Cash Dividend on A Shares for the Year 2019, Payable on 09 October 2020	24/09/20	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2020	26/08/20	CI
Shenzhen Danbond Technology Co.,Ltd. Announces Cash Dividend	17/08/20	CI
Shenzhen Danbond Technology Co.,Ltd. Announces Final Cash Dividend for the Year 2019	30/06/20	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2020	29/04/20	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Full Year Ended December 31, 2019	27/04/20	CI
Shenzhen Danbond Technology Co.,Ltd. announced that it expects to receive CNY 1.78 billion in funding	02/04/20	CI
Shenzhen Danbond Technology Co.,Ltd. cancelled the transaction announced on June 13, 2019	02/04/20	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2019	22/10/19	CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2019	27/08/19	CI
Shenzhen Danbond Technology Co.,Ltd.(SZSE:002618) added to Shenzhen Stock Exchange Component Index	12/07/19	CI
Shenzhen Danbond Technology Co.,Ltd. Announces Final Cash Dividend on A Shares for the Year 2018, Payable on 12 July 2019	05/07/19	CI
Shenzhen Danbond Technology Co.,Ltd. announced that it expects to receive CNY 2.15 billion in funding	12/06/19	CI

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Company Profile

Shenzhen Danbond Technology Co., Ltd. is a China-based company, principally engaged in the research and development, manufacture and distribution of electronic components. The Company's products mainly include flexible printed circuit boards (FPCs), chip on film (COF) flexible packaging substrates, as well as COF products. The Company's products are mainly applied in electronic terminals. The Company distributes its products within domestic market and to overseas markets, with Japan as its major market.

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