Shenzhen Danbond Technology Co.,Ltd. (SZSE:002618) announced a private placement of not more than 10,958,400 shares for gross proceeds of not more than CNY 2,150,000,000 on June 13, 2019. The transaction will include participation from not more than ten investors, including securities investment fund management companies, securities companies, trust and investment companies, financial companies, insurance institutional investors, qualified foreign institutional investors, and other qualified foreign institutional investors. The issue price is not less than 90% of the company's average stock price 20 days before the pricing benchmark date. The transaction has been approve at the 10th meeting of the company's 4th directorate and its 4th supervisory board’s 6th meeting and is still subject to its shareholder's approval and China Securities Regulatory Commission.