Rambus to Demonstrate IoT Security Technology in Qualcomm Booth at CES
January 03, 2017 at 09:30 pm
Share
Rambus announced it will showcase its IoT security service and technology designed to deliver secure communication and lifecycle management. This demonstration utilizes the Rambus CryptoManager security platform and highlights how IoT devices can be secured to significantly reduce service vulnerability to Distributed Denial of Service (DDoS) attacks. This demonstration, highlighting a smart city application, features the Qualcomm® SnapdragonTM 820 processor and QCA4010 Wi-Fi chip, that are connected to an IoT cloud service using a protected link. The Rambus technology enables seamless security-focused features which includes mutual authentication and encrypted communication. These unique security features protect IoT devices from being used by hackers in malicious botnets, and prevent the IoT cloud service from being attacked by cloned devices. The first public demonstration of this technology will be showcased exclusively in the Qualcomm Technologies Inc.’s booth (#10948) at CES® 2017 in Las Vegas, January 5-8, 2017.
Rambus Inc. is a provider of chips, silicon intellectual property (IP) and innovations that address the fundamental challenges of accelerating data and enabling critical performance improvements for data center and other growing markets. It offers a balanced and diverse portfolio of solutions across chips, silicon IP and patent licensing. Its Rambus Double Data Rate (DDR) memory interface chips for server memory modules enable increased bandwidth and expanded capacity in enterprise and cloud servers. Its portfolio includes DDR5 and DDR4 memory interface chipsets. Its DDR5 chipset solution includes the Registering Clock Driver (RCD), Serial Presence Detect Hubs (SPD Hub) and Temperature Sensors (TS). Rambus Silicon IP includes interface and security IP solutions that move and protect data in advanced data center, government and automotive applications. It sells memory interface chips directly and indirectly to memory module manufacturers and original equipment manufacturers (OEMs).