Mitsubishi Electric : to Launch 1,200V Large DIPIPM Ver.6 and 1,200V Mini DIPIPM
June 30, 2014 at 03:24 am
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Note that the releases are accurate at the time of publication but may be subject to change without notice.
TOKYO, June 30, 2014 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today the launch of its 1,200V large transfer-mold dual in-line package intelligent power module (DIPIPMTM) Ver.6 and 1,200V Mini DIPIPM using sixth-generation IGBT chips featuring the carrier-stored trench-gate bipolar transistor (CSTBTTM) structure. Both modules reduce the power consumption, size and weight of inverter systems for motors used in air conditioners and industrial applications. Sales begin September 30.
The new models will be exhibited at MOTORTECH JAPAN 2014 during TECHNO-FRONTIER 2014 at Tokyo Big Sight in Japan from July 23 to 25.
Product Features
1)
Reduced power consumption and simpler design for inverter systems
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Sixth-generation IGBT chips featuring the CSTBT structure enable power loss to be reduced by about 10% compared to Mitsubishi Electric's existing Large DIPIPM products (Large DIPIPM Ver.4 series, 5A-35A).
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Reduced external components thanks to built-in bootstrap diode (BSD) with current limit resistor.
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Reduced heat dissipation by improving the accuracy of temperature detection output.
2)
Downsizing and weight reduction with Mini DIPIPM package: 1,200V Mini DIPIPM
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By employing a Mini DIPIPM package for the first time in a 1,200V product, the profile (31.0 x 52.5mm) was reduced about 34% compared with Mitsubishi Electric's existing Large DIPIPM Ver.4 series (31.0 x 79.0mm).
Mitsubishi Electric Corporation is one of the world's leading manufacturers of electric and electronic equipment. Net sales (including intragroup) break down by family of products and by services as follows:
- industrial automation equipment (28.6%): programmable controllers, motor operators, counters, industrial robots, clutches, etc.;
- electric equipment (24.2%): generators, motors, transformers, power circuit breakers, testing systems, etc.;
- household appliances (22.4%): televisions, video recorders, air conditioners, refrigerators, lamps, vacuum cleaners, etc.;
- information and communication equipment (6.9%): mobile phones, satellites, aerials, medical and audiovisual equipment, servers, computers, etc.;
- electronic components and devices (4.7%): memory, logic integrated circuits, monitors, plasma screens, printed circuit cards, etc.;
- other (13.2%): financial services, real estate management, engineering and maintenance services, etc.
Net sales break down geographically as follows: Japan (52.1%), Asia (24.9%), Europe (11.1%), North America (10.3%) and other (1.6%).