Printed circuit boards help power some of the industry's greatest and most advanced technologies, so ensuring their proper functionality is paramount. Yet electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive printed circuit board bending.

Electrical testing or non-destructive testing methods cannot detect pad cratering cracks, which pose a long-term risk to reliability since cracks may spread under increased loads and subsequently lead to electrical failure. Since the beginning of pad cratering doesn't produce an instantaneous electrical signature, early detection has been an issue.

Currently, the industry is challenged by the inability to detect pad cratering without an explicit electronic signature in an efficient fashion. The process of pad cratering initiates well ahead of actual electronic failure, which gives ample time for detection and location, provided the right diagnostic solution is in place - like Acoustic Emission (AE) testing.

For more information, call MISTRAS at 1(609) 716-4000 today!

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