Lingsen Precision Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2019
May 09, 2019 at 09:53 pm
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Lingsen Precision Industries, Ltd. announced earnings results for the first quarter ended March 31, 2019. For the first quarter, the company announced sales was TWD 990.423 million compared to TWD 1,418.076 million a year ago. Operating loss was TWD 225.825 million compared to TWD 99.997 million a year ago. Net loss was TWD 217.484 million compared to TWD 80.562 million a year ago. Basic loss per share was TWD 0.58 compared to TWD 0.22 a year ago.
LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.