2017年3月期
Financial Report for Fiscal Year決算Ended説明March資料31, 2023
JAPAN PURE CHEMICAL CO.,LTD.
Securities Code: 4973
証券コード:4973
January 27, 2022
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Glossary(1) (Plating Method)
Term | Applications | Explanation |
Electrolytic | - | Plating method on metal surfaces with |
plating | electric current | |
Pure gold | Printed circuit boards | High-purity gold plating |
plating | Semiconductor substrates | |
Hard gold | Connectors | Gold plating that is hardened with alloy |
plating | Printed circuit boards | components |
Palladium(Pd) | Lead frames | Used as undercoat for gold plating. |
plating | Connectors | PPF stands for Pre Plated Lead frame. |
Electroless | - | Plating method by chemical reaction without |
plating | electric current | |
Immersion | Plating method for forming by replacing | |
Printed circuit boards | metal on surface by utilizing Solubility | |
plating | ||
(Ionization tendency) of each metal | ||
Auto catalytic | Plating method capable of forming thick | |
Printed circuit boards | coatings by utilizing chemical reaction with | |
plating | reducing agent | |
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Glossary(2) (Plating Process)
Term | Explanation | Layer composition |
ENIG | Stands for Electroless Nickel Immersion Gold. | |
Layer Composition is Cu-Ni-Au. | ||
Stands for Electroless Nickel Electroless Palladium | ||
ENEPIG | Immersion Gold. | |
Layer Composition is Cu-Ni-Pd-Au. | ||
Stands for Direct Immersion Gold. Since Ni plating is | ||
DIG | omitted, it can be used for fine pitch compared to | |
ENIG. Layer Composition is Cu-Au. | ||
EPIG | Stands for Electroless Palladium Immersion Gold. | |
Layer Composition is Cu-Pd-Au. | ||
Copyright © JAPAN PURE CHEMICAL CO.,LTD. All rights reserved. May not be copied or reprinted without prior written approval. | 2 |
Product Lineup ~ Lineup Expansion and New Field Development ~
Plating Methods | Applications | Product Lineup |
plating | Pure gold | 1. Pure gold plating enabling uniform coating even on rough surfaces | |
2. Pure gold plating with higher hardness | |||
Electrolytic | Hard gold | Gold saving hard gold plating for micro connectors: OROBRIGHT BAR7 | |
(Alloy) | |||
Palladium | Palladium plating for thin coating applicable to PPF: PALLABRIGHT NANO2 | ||
(Pd) | |||
plating | Immersion gold plating compatible with mid- to high-P Ni: IM-GOLD IB2X | ||
Immersion gold | Immersion gold plating with less Ni corrosion: IM-GOLD CN | ||
Immersion gold plating without Ni plating: IM-GOLD PC | |||
Electroless | Auto catalytic | Auto catalytic gold plating for thin coating using gold sulfite: HY-GOLD | |
palladium | Direct auto catalytic palladium plating: NEO PALLABRIGHT DP | ||
gold | Auto catalytic gold plating for thin coating using gold cyanide: HY-GOLD CN | ||
Auto catalytic | Auto catalytic palladium plating for ENEPIG: NEO PALLABRIGHT 2 | ||
New fields | Base metals (copper, tin, nickel) | ||
Alloy plating | Post-treatment agents | ||
Copyright © JAPAN PURE CHEMICAL CO.,LTD. All rights reserved. May not be copied or reprinted without prior written approval. | 3 |
Financial Review for 3Q of FY2022 (1)
Electronic Components Industry
- Continued uncertainty in the economic environment, including the protracted situation in Ukraine and persistently high inflation, has led to a refrain from investment for cloud/data centers and for IoT devices on digital transformation in industrial machinery, factories, healthcare, and other areas.
- Production of electronic components for smartphones and PCs continues to decline due to inventory adjustments.
- In automotive electronic components, production adjustment of automobiles continued and did not lead to a recovery trend.
JPC's Financial Review
Plating chemicals for printed circuit boards and semiconductor substrates
It has continued since the second quarter that low level of sales in plating chemicals for PCBs and semiconductor substrates, affected by sluggish demand from Chinese and Korean manufacturers for smartphones and production cutbacks in PCs and memory applications.
Plating chemicals for connectors
Sales of plating chemicals for connectors remained sluggish, as strong demand for industrial machinery and communication infrastructure could not make up for the impact of reduced production of smartphones by Chinese and South Korean manufacturers.
Plating chemicals for lead frames
Although they have got affected by continues production cutbacks by Chinese and Korean makers for smartphones and PCs since the second quarter, the decrease of sales in plating chemicals for lead frames was limited to a slight decline, supported by firm demand for some automotive and consumer electronics applications.
Copyright © JAPAN PURE CHEMICAL CO.,LTD. All rights reserved. May not be copied or reprinted without prior written approval. | 4 |
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JPC - Japan Pure Chemical Co. Ltd. published this content on 27 January 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 21 February 2023 00:49:06 UTC.