Resonac Corporation (Resonac) (President: Hidehito Takahashi) has concluded new multiyear contracts with Infineon Technologies AG (Infineon), a German semiconductor manufacturer providing power semiconductors worldwide, to continue supplying SiC materials for power semiconductors to Infineon and cooperatively developing technologies related to SiC materials.

Resonac concluded these new contracts in order to complement and expand the preceding supply and joint development contracts concluded in 2021 1, thereby strengthening the partnership with Infineon.

Resonac expects this partnership will enable Infineon to apply Resonac's SiC materials to various power semiconductor products, and now Resonac plans to provide Infineon with SiC materials of 200mm (8-inch) diameter, in addition to those of 150mm (6-inch) diameter. Furthermore, Resonac will accelerate improvement in technologies for and product quality of SiC epitaxial wafers through reinforced joint development activities with Infineon. Resonac and Infineon are confident that the strengthened partnership of the two companies will support rapid growth of the market for SiC materials, which are next-generation materials for semiconductors, and contribute to stabilization of the supply chain of SiC-based power semiconductors.

The Resonac Group aims to contribute to sustainable development of global society as a 'Co-creative chemical company,' and the Group positions its SiC epitaxial wafer business as a next-generation business because SiC-based power semiconductor realizes efficient use of energy. Under a motto of 'Best in Class,' the Resonac Group will continue providing the market with high-performance and highly-reliable SiC products, thereby contributing to the proliferation of SiC power semiconductors.

(C) 2023 Electronic News Publishing, source ENP Newswire