Inari Amertron

INARI

MYQ0166OO007

Semiconductors

End-of-day quote BURSA MALAYSIA Other stock markets 23:00:00 27/05/2024 BST			5-day change	1st Jan Change
3.4 ^MYR	-0.29%		+5.92%	+12.96%

05-24	Inari Amertron's Profit, Revenue Rise in Fiscal Q3	MT
05-23	Inari Amertron Berhad Announces Third Interim Single Tier Dividend for the Year Ending 30 June 2024, payable on July 5, 2024	CI

Inari Amertron Berhad Declares First Interim Single Tier Dividend for the Financial Year Ending 30 June 2023, Payable on 06 January 2023

November 17, 2022 at 12:39 pm

Inari Amertron Berhad declared First interim single tier dividend of 2.6 sen per ordinary share for the Financial Year Ending 30 June 2023. Ex-Date 08 December 2022, Entitlement date 09 December 2022, Payment Date 06 January 2023.

Latest news about Inari Amertron

Inari Amertron's Profit, Revenue Rise in Fiscal Q3	05-24	MT
Inari Amertron Berhad Announces Third Interim Single Tier Dividend for the Year Ending 30 June 2024, payable on July 5, 2024	05-23	CI
Inari Amertron Berhad Reports Earnings Results for the Third Quarter and Nine Months Ended March 31, 2024	05-23	CI
Penumbra, Inc. : The underdog in healthcare	04-12
Inari Amertron Berhad Reports Earnings Results for the Second Quarter and Six Months Ended December 31, 2023	02-26	CI
Inari Amertron Berhad Proposes Second Interim Single Tier Dividend for the Year Ending June 30, 2024, Payable on 05 April 2024	02-26	CI
Inari Amertron Berhad Appoints ONG ENG BIN as Independent and Non Executive Member of Risk Committee	01-31	CI
Inari Amertron Berhad Appoints DATO ONG ENG BIN as Independent and Non Executive Director	01-31	CI
Inari Amertron Offers Share Options to Directors, Employees	01-10	MT
Chinese firms look to Malaysia for assembly of high-end chips, sources say	12-17	RE
Dialog, Westports Replaced by YTL Power, YTL in Malaysia's KLCI Index	11-30	DJ
Inari Amertron Berhad Announces Retirement of Dato' Sri Chee Hong Leong, Jp as Independent and Non Executive Member of Risk Committee	11-23	CI
Inari Amertron Berhad Announces Retirement of Dato Sri Chee Hong Leong, JP as Independent and Non Executive Director	11-23	CI
Inari Amertron Berhad Reports Earnings Results for the First Quarter Ended September 30, 2023	11-22	CI
Inari Amertron Berhad Announces First Interim Dividend for the Financial Year Ending June 30, 2024, Payable on January 05, 2024	11-22	CI
Inari Amertron Trims Dividend as Profit Drops in Fiscal Q4	30/08/23	MT
Inari Amertron Berhad Reports Earnings Results for the Fourth Quarter and Full Year Ended June 30, 2023	29/08/23	CI
Inari Amertron Berhad Announces Fourth Interim Dividend for the Year Ended June 30, 2023, Payable on 06 October 2023	29/08/23	CI
Inari Amertron Cuts Dividend as Profit Drops in Fiscal Q3	26/05/23	MT
Inari Amertron Berhad Announces Third Interim Single Tier Dividend, Payable on July 7, 2023	25/05/23	CI
Inari Amertron Berhad Reports Earnings Results for the Third Quarter and Nine Months Ended March 31, 2023	25/05/23	CI
Inari Amertron Berhad Appoints Mohamad Azmi Bin Ali as Independent and Non Executive Member of Remuneration Committee	13/03/23	CI
Inari Amertron Berhad Announces Re-Designation of Datuk Phang Ah Tong as Independent and Non Executive Chairman of Remuneration Committee from Independent and Non Executive Member of Remuneration Committee	13/03/23	CI
Inari Amertron Berhad Appoints Dato' Sri Chee Hong Leong, JP as Independent and Non Executive Member of Risk Committee	13/03/23	CI
Inari Amertron Berhad Appoints Datuk Mohamed Arsad Bin Sehan as Independent and Non Executive Chairman of Nomination Committee	13/03/23	CI

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Company Profile

Inari Amertron Berhad is a Malaysia-based company that is engaged in the investment holding and the provision of management services. The Company operates as an outsourced semiconductor assembly and test (OSAT) service provider for radio frequency, fiber-optics transceivers, opto-electronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed, and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.

Sector

Semiconductors

Calendar

26/08/2024 - Q4 2024 Earnings Release (Projected)

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Ratings for Inari Amertron

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Investor Rating

ESG Refinitiv

B+

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Analysts' Consensus

Sell

Buy

Mean consensus

OUTPERFORM

Number of Analysts

Last Close Price

3.4 MYR

Average target price

3.552 MYR

Spread / Average Target

+4.46%

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Inari Amertron

Equities

INARI

MYQ0166OO007

Semiconductors

Inari Amertron Berhad Declares First Interim Single Tier Dividend for the Financial Year Ending 30 June 2023, Payable on 06 January 2023

EPS Revisions