HB SOLUTION Co., Ltd.

A297890

KR7297890006

Semiconductor Equipment & Testing

End-of-day quote Korea S.E. Other stock markets 23:00:00 09/05/2024 BST			5-day change	1st Jan Change
6,700 ^KRW	-4.96%		+0.45%	+26.65%

2023	HB SOLUTION Co., Ltd. announced that it has received KRW 40 billion in funding from HB Technology CO.,LTD. and other investor	CI
2023	HB SOLUTION Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	CI

HB Solution Co.,Ltd. authorizes a Buyback Plan.

June 14, 2022

The Board of Directors of HB Solution Co.,Ltd. has authorized a buyback plan on June 15, 2022.

Latest news about HB SOLUTION Co., Ltd.

HB SOLUTION Co., Ltd. announced that it has received KRW 40 billion in funding from HB Technology CO.,LTD. and other investor	21/08/23	CI
HB SOLUTION Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	11/05/23	CI
HB SOLUTION Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	20/03/23	CI
Tranche Update on HB SOLUTION Co., Ltd.'s Equity Buyback Plan announced on June 15, 2022.	15/12/22	CI
Tranche Update on HB SOLUTION Co., Ltd.'s Equity Buyback Plan announced on June 15, 2022.	15/12/22	CI
HB SOLUTION Co., Ltd.'s Equity Buyback announced on June 15, 2022, has expired with 385,437 shares, representing 2.32% for KRW 4,963.75 million.	14/12/22	CI
Tranche Update on HB SOLUTION Co., Ltd.'s Equity Buyback Plan announced on June 15, 2022.	15/09/22	CI
HB Solution Co.,Ltd. announces an Equity Buyback for KRW 5,000 million worth of its shares.	15/06/22	CI
HB Solution Co.,Ltd. authorizes a Buyback Plan.	14/06/22	CI
HB Solution Co.,Ltd. announced that it has received KRW 40 billion in funding	21/10/21	CI
HB Solution Co.,Ltd.(KOSDAQ:A297890) added to S&P Global BMI Index	20/09/21	CI
HB Solution Co.,Ltd. announced that it expects to receive KRW 40 billion in funding	15/09/21	CI
Korea Materials & Analysis Corp. completed the acquisition of LET co., Ltd from HB Technology CO.,LTD. and other shareholders in a reverse merger transaction.	30/06/21	CI
Korea Materials & Analysis Corp. signed a merger contract to acquire LET co., Ltd from HB Technology CO.,LTD. and other shareholders for approximately KRW 120 billion in a reverse merger transaction.	29/03/21	CI
LET co., Ltd has completed an IPO in the amount of KRW 17.1366 billion.	15/06/20	CI
Korea Materials & Analysis Corp. announced that it has received KRW 1.00000009 billion in funding from HB Technology CO.,LTD.	03/06/20	CI
Korea Materials & Analysis Corp. announced that it expects to receive KRW 1.00000009 billion in funding from HB Technology CO.,LTD.	26/05/20	CI
LET co., Ltd has filed an IPO.	29/10/19	CI
HB Technology Co., Ltd. completed the acquisition of 34% stake in LET Co., Ltd from Heunggeun Lee, Jihyun Cho, Jungsik Yoon, Youngkyung Kim and Ilho Kim.	13/08/18	CI
HB Technology Co., Ltd. agreed to acquire 34% stake in LET Co., Ltd from Heunggeun Lee, Jihyun Cho, Jungsik Yoon, Youngkyung Kim and Ilho Kim for KRW 26.6 billion	27/06/18	CI
Sugentech Incorporate completed the acquisition of K-MAC BIO CENTER Corp. from Korea Materials & Analysis Corp..	14/07/17	CI
Sugentech Incorporate announced that it has received KRW 4.000008 billion in funding from Korea Materials & Analysis Corp.	19/06/17	CI
Sugentech Incorporate entered into a contract to acquire K-MAC BIO CENTER Corp. from Korea Materials & Analysis Corp. for KRW 16.7 billion.	14/06/17	CI
Korea Materials & Analysis Corp. announced that it has received KRW 15 billion in funding from HB Technology Co., Ltd., Eugene investment & Securities Co., Ltd., Investment Arm, BNK Securities Co., Ltd., Investment Arm	09/11/16	CI
Korea Materials & Analysis Corp. announced that it expects to receive KRW 15 billion in funding from HB Technology Co., Ltd., Eugene investment & Securities Co., Ltd., Investment Arm, BNK Securities Co., Ltd., Investment Arm	08/11/16	CI

HB Solution Co Ltd, formerly LET Co Ltd is a Korea-based company mainly engaged in the production and sale of display manufacturing equipment. The Company mainly manufactures and sells products including assembling machines for attaching the fingerprint sensor to the back of the display; applicators for applying, curing, and inspecting silicone; inspectors for inspecting indentation and lamination of conductive ball between electrodes; and new technology automation equipment to produce ultra-thin tempered flexible glass, among others.

Sector

Semiconductor Equipment & Testing

Calendar

08/08/2024 - Q2 2024 Earnings Release (Projected)

More about the company

Income Statement Evolution

More financial data

Annual profits - Rate of surprise

Company calendar

Sector Semiconductor Machinery Manufacturing

	1st Jan change	Capi.
HB SOLUTION CO., LTD.	+26.65%	339M
APPLIED MATERIALS, INC.	+29.41%	174B
DISCO CORPORATION	+45.45%	35.37B
ASM INTERNATIONAL N.V.	+32.31%	32.96B
GLOBALFOUNDRIES, INC.	-15.69%	28.28B
NAURA TECHNOLOGY GROUP CO., LTD.	+21.26%	21.89B
ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA	-13.39%	11.42B
BE SEMICONDUCTOR INDUSTRIES N.V.	-2.27%	11.06B
HANMI SEMICONDUCTOR CO., LTD.	+125.45%	9.8B
KOKUSAI ELECTRIC CORPORATION	+39.48%	6.39B

Semiconductor Machinery Manufacturing