Formosa Advanced Technologies Co., Ltd.

8131

TW0008131004

Semiconductor Equipment & Testing

End-of-day quote Taiwan S.E. Other stock markets 23:00:00 21/05/2024 BST			5-day change	1st Jan Change
39 ^TWD	+1.17%		+1.83%	0.00%

05-09	Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	CI
02-23	Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	CI

Formosa Advanced Technologies Co., Ltd. Announces Demise of Hsie, Shih-Ming, Vice Chairman and President

January 10, 2022 at 11:22 am

Formosa Advanced Technologies Co., Ltd. announced the demise of the Vice Chairman and president of the company, Hsie, Shih-Ming on January 10, 2022.

Latest news about Formosa Advanced Technologies Co., Ltd.

Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	05-09	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	02-23	CI
Formosa Advanced Technologies Co., Ltd. Announces Change of Chief Information Security Officer	02-01	CI
Formosa Advanced Technologies Co., Ltd. Appoints Chang Wu-Huang as Members of the Compensation Committee	12-15	CI
Formosa Advanced Technologies Co., Ltd. Announces the Dismissal of Shen Hui Ya, Sustainable Development Committee Member	11-09	CI
Formosa Advanced Technologies Co., Ltd. Announces Demise of Shen Hui Ya, Remuneration Committee Member	11-09	CI
Formosa Advanced Technologies Co., Ltd. Announces the Demise of Shen Hui Ya, Audit Committee Member	11-09	CI
Formosa Advanced Technologies Co., Ltd. Announces Demise of Shen Hui Ya, Independent Director	11-09	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	11-08	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	02/08/23	CI
Formosa Advanced Technologies Co., Ltd. Announces Distribution of Cash Dividend, Payable on August 16, 2023	14/06/23	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	03/05/23	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	22/02/23	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	02/11/22	CI
Formosa Advanced Technologies Co., Ltd. Appoints Chih-Hao Huang as Chief internal auditor	02/11/22	CI
Formosa Advanced Technologies Co., Ltd. Announces Change of Principal Accounting Officer	27/10/22	CI
Formosa Advanced Technologies Co., Ltd. Announces Removal of Lin Tsai-Hsien as Principal Accounting Officer	21/09/22	CI
Formosa Advanced Technologies Co., Ltd. Appoints Huang Chung-Hou as Chief Information Security Officer	19/09/22	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	03/08/22	CI
Formosa Advanced Technologies Co., Ltd. Promotes Chang Hsien Cheng to the Acting President	03/08/22	CI
Formosa Advanced Technologies Co., Ltd. Resolves to Set Up Sustainable Development Committee	24/06/22	CI
Formosa Advanced Technologies Co., Ltd. Resolves the Compensation Committee Members	24/06/22	CI
Formosa Advanced Technologies Co., Ltd. Announces New Chairman of the Company	24/06/22	CI
Formosa Advanced Technologies Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022	04/05/22	CI
Formosa Advanced Technologies Co., Ltd. Announces Resignation of Liao Cheng-Chieh as Principal Accounting Officer	18/03/22	CI

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Formosa Advanced Technologies Co., Ltd. is a Taiwan-based company principally engaged in the provision of integrated circuit (IC) assembly and related testing services and module services. The Company provides services applied in thin small outline packages (TSOPs), small outline packages (SOPs), quad flat packages (QFPs), thin quad flat packages (TQFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light emitting diodes (LED) wafers, among others. The Company operates its businesses principally in Taiwan, Hong Kong and South Korea.

Sector

Semiconductor Equipment & Testing

Calendar

25/06/2024 - Annual General Meeting

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Sector Semiconductor Testing Equipment & Service

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