Announcement of the Company's
financial report for the second quarter of 2022.
Date of events
2022/08/03
To which item it meets
paragraph 31
Statement
1.Date of submission to the board of directors or approval by the board of
directors: 2022/08/03
2.Date of approval by the audit committee: 2022/08/03
3.Start and end dates of financial reports or annual self-assessed financial
information of the reporting period (XXXX/XX/XX~XXXX/XX/XX): 2022/01/01 ~
2022/06/30
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):5,261,728
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD): 1,122,216
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD): 1,000,211
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD): 1,401,312
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD): 1,146,446
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD): 1,146,446
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD): 2.59
11.Total assets end of the period (thousand NTD): 15,302,516
12.Total liabilities end of the period
(thousand NTD): 3,288,070
13.Equity attributable to owners of parent end of the
period (thousand NTD): 12,014,446
14.Any other matters that need to be specified: None
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Formosa Advanced Technologies Co. Ltd. published this content on 03 August 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 03 August 2022 06:51:05 UTC.
Formosa Advanced Technologies Co., Ltd. is a Taiwan-based company principally engaged in the provision of integrated circuit (IC) assembly and related testing services and module services. The Company provides services applied in thin small outline packages (TSOPs), small outline packages (SOPs), quad flat packages (QFPs), thin quad flat packages (TQFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light emitting diodes (LED) wafers, among others. The Company operates its businesses principally in Taiwan, Hong Kong and South Korea.