Inactive Instrument

EM Networks Corporation

A087730

KR7087730008

EM Networks Corporation Reports Earnings Results for the Full Year Ended December 31, 2022

April 14, 2023 at 07:22 am

EM Networks Corporation reported earnings results for the full year ended December 31, 2022. For the full year, the company reported sales was KRW 0.00034 million compared to KRW 674.95 million a year ago. Net loss was KRW 3,801.32 million compared to KRW 16,324.43 million a year ago.

Basic loss per share from continuing operations was KRW 1,602 compared to KRW 5,013 a year ago. Diluted loss per share from continuing operations was KRW 1,602 compared to KRW 5,013 a year ago. Basic loss per share was KRW 1,602 compared to KRW 5,013 a year ago.

Diluted loss per share was KRW 1,602 compared to KRW 5,013 a year ago.

Latest news about EM Networks Corporation

EM Networks Corporation Reports Earnings Results for the Full Year Ended December 31, 2022	14/04/23	CI
EM Networks Corporation Reports Earnings Results for the Full Year Ended December 31, 2021	31/03/22	CI
NEPES AMC cancelled the acquisition of remaining 22% stake in NMT Co., Ltd..	16/07/20	CI
ESMO Materials Corporation announced that it expects to receive KRW 1.6 billion in funding from Samsung Securities Co. Ltd., Investment Arm, KEB Hana Bank, Investment Arm, Shinhan Financial Investment Co., Ltd.	26/02/20	CI
ESMO Materials Corporation announced that it has received KRW 1.07654 billion in funding from NNF Co., Ltd.	20/02/20	CI
ESMO Materials Corporation announced that it expects to receive KRW 1.07654 billion in funding from NNF Co., Ltd.	17/02/20	CI
ESMO Materials Corporation announced that it has received KRW 15.5 billion in funding	14/01/20	CI
ESMO Materials Corporation announced that it expects to receive KRW 15.5 billion in funding	13/01/20	CI
ESMO Materials Corporation agreed to acquire an unknown minority stake in Global Rare Earth Limited for KRW 5.2 billion.	02/01/20	CI
ESMO Materials Corporation announced that it has received KRW 10 billion in funding	26/09/19	CI
ESMO Materials Corporation announced that it expects to receive KRW 10 billion in funding	25/09/19	CI
NEPES AMC entered into a contract to acquire remaining 22% stake in NMT Co., Ltd. for KRW 7 billion.	30/06/19	CI
GIL Co., Ltd. announced that it has received KRW 5 billion in funding from NEPES AMC	28/04/19	CI
ESMO Materials Corporation announced that it has received KRW 44 billion in funding	17/04/19	CI
An unknown buyer acquired 25.6% stake in NEPES AMC from Keystone Private Equity, a fund managed by Keystone Private Equity.	11/03/19	CI
NEPES AMC announced that it has received KRW 2 billion in funding from Samsung Securities Co. Ltd., Investment Arm, KEB Hana Bank, Investment Arm, Shinhan Investment Corp., Investment Arm	21/02/19	CI
NEPES AMC announced that it expects to receive KRW 2 billion in funding from Samsung Securities Co. Ltd., Investment Arm, KEB Hana Bank, Investment Arm, Shinhan Investment Corp., Investment Arm	20/02/19	CI
NEPES AMC announced that it expects to receive KRW 30 billion in funding	30/09/18	CI
NEPES AMC announced that it has received KRW 25.5 billion in funding	13/09/18	CI
NEPES Mulls Acquisitions	04/07/18	CI
NEPES AMC announced that it expects to receive KRW 50 billion in funding	02/07/18	CI
ESMO Materials Corporation announced that it has received KRW 39.99998925 billion in funding	18/06/18	CI
An unknown buyer acquired 31.47% stake in NEPES AMC from Keystone Hightech No.1 Private Equity Fund.	22/04/18	CI
Keystone Hightech No.1 Private Equity Fund completed the acquisition of 31.5% stake in NEPES AMC from Nepes Corporation, Byunggu Lee and Sungja Lee.	17/04/18	CI
Keystone Hightech No.1 SPC Limited signed a contract to acquire 31.5% stake in NEPES AMC from Nepes Corporation, Byunggu Lee and Sungja Lee for KRW 22.9 billion.	26/02/18	CI

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Company Profile

EM Networks Corp, formerly ESMO Materials Corp, is a Korea-based company mainly engaged in the provision of plastic resins materials used for semiconductors. The Company's product portfolio consists of epoxy molding compound (EMC), printable die attach adhesives, clear molding compound (CMC), white epoxy molding compound and silicone encapsulant, which are used for semiconductors and light emitting diodes (LEDs), as well as underfill resin for chip-on-films (COFs). The Company's products are sold under the brand name of LEMOCOM. The Company distributes its products in domestic and overseas markets.

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