CyberOptics® Corporation announced it will demonstrate its next generation Airborne Particle Sensor technology (APS3) 300mm with new ParticleSpectrum™ software at SEMICON Korea, January 31, through February 2, at the Seoul COEX in booth # A418. CyberOptics’ WaferSense® APS3 speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles in real-time. CyberOptics’ Airborne Particle Sensors, documented as the best known method (BKM), have proven to deliver up to 90% timesavings, 95% expense reduction and up to 20X the throughput with half the manpower relative to legacy surface scan wafer methods. The APS3 measurement devices are even thinner and lighter to travel through semiconductor tools with ease, while providing the accuracy and sensitivity valued by equipment and process engineers around the world. The APS3 solution incorporates ParticleSpectrum software – a completely new, touch-enabled interface with user-friendly functionality, making it simple to read in real-time, record and review small to large airborne particle data. At SEMICON Korea, CyberOptics will also unveil a new Airborne Particle Sensor designed for the Flat Panel Display (FPD) market. The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensors and the new Auto Multi Sensor (AMS), are available in various wafer shaped form factors depending on the device, including 150mm, 200mm and 300mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensors (APSR & APSRQ), the Auto Leveling System (ALSR) and the Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.