Camtek Ltd. announced the introduction of a new Eagle model utilizing a revolutionary technology to detect inner cracks occurring during the dicing process. These side wall cracks are not visible to standard inspection and testing techniques, and can ultimately cause failure in end-products or mission critical systems such as in the automotive industry, resulting in significant losses to the manufacturers of the end user devices. Camtek’s new Inner Crack Imaging (ICI) technology provides fast detection of inner cracks during wafer level inspection immediately after dicing in a high volume production environment.